td62597apg TOSHIBA Semiconductor CORPORATION, td62597apg Datasheet
td62597apg
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td62597apg Summary of contents
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... TD62591APG, TD62592APG, TD62593APG TD62594APG TD62591~594APG,595~598APG/AFG TD62591APG, TD62592APG, TD62593APG TD62594APG, TD62595APG, TD62596APG TD62597APG, TD62598APG TD62595AFG, D62596AFG TD62597AFG, TD62598AFG external. 10.5 kΩ 2.7 kΩ 10.5 kΩ Weight DIP18-P-300-2.54D : 1.47 g (typ.) SOP18-P-375-1.27 : 0.41 g (typ.) Pin Connection (top view) TD62595APG, TD62595AFG, TD62596APG, TD62596AFG TD62597APG, TD62597AFG, TD62598APG, TD62598AFG 1 2006-06-14 ...
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... Note 2: Except TD62591APG, TD62595APG, TD62595AFG Note 3: Only TD62591APG, TD62595APG, TD62595AFG Note 4: Delated above 25°C in the proportion of 11.7mW / °C (APG−Type), 7.7mW / °C (AFG−Type) Note 5: SOP−18pin TD62591~594APG,595~598APG/AFG TD62592APG, TD62593APG, TD62594APG TD62596APG, TD62596AFG, TD62597APG, TD62597AFG, TD62598APG, TD62598AFG (Ta = 25°C) SYMBOL RATING UNIT ...
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Recommended Operating Conditions CHARACTERISTIC Collector−Emitter Voltage Collector−Base Voltage Collector Current Clamp Diode Reverse Voltage Input Voltage Input Current TD62592 TD62596 Input Voltage TD62593 (Output On) TD62597 TD62594 TD62598 APG Power Dissipation AFG Electrical Characteristics (Ta = 25°C unless otherwise noted) ...
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... Note 2: See below Input Condition TYPE NUMBER TD62591APG, TD62595APG, TD62595AFG TD62592APG, TD62596APG, TD62596AFG TD62593APG, TD62597APG, TD62597AFG TD62594APG, TD62598APG, TD62598AFG Note 3: C includes probe and jig capacitance L Precautions for Using This IC does not integrate protection circuits such as overcurrent and overvoltage protectors. ...
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TD62591~594APG,595~598APG/AFG 5 2006-06-14 ...
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TD62591~594APG,595~598APG/AFG 6 2006-06-14 ...
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Package Dimensions DIP18−P−300−2.54D Weight: 1.47 g (Typ.) TD62591~594APG,595~598APG/AFG 7 Unit: mm 2006-06-14 ...
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Package Dimensions SOP18−P−375−1.27 Weight: 0.50 g (Typ.) TD62591~594APG,595~598APG/AFG 8 Unit: mm 2006-06-14 ...
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Notes on Contents 1. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 2. Test Circuits Components in the test circuits are used only to obtain and confirm the ...
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Points to Remember on Handling of ICs (1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the ...
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About solderability, following conditions were confirmed • Solderability (1) Use of Sn-37Pb solder Bath · solder bath temperature = 230°C · dipping time = 5 seconds · the number of times = once · use of R-type flux (2) Use ...