hsdl-3610 Avago Technologies, hsdl-3610 Datasheet - Page 18

• Manufacturer Part Number: hsdl-3610
• Description: Irda Data Compliant 115.2 Kb/s Infrared Transceiver
• Manufacturer: Avago Technologies

2.1 Recommended Metal Solder
Stencil Aperture
It is recommended that only 0.152
mm (0.006 inches) or 0.127 mm
(0.005 inches) thick stencil be
used for solder paste printing.
Figure 4.0. Solder paste stencil aperture.
3.0 Pick and Place Misalignment
Tolerance and Product Self-
Alignment after Solder Reflow
If the printed solder paste volume
is adequate, the unit will self-
align in the X-direction after
solder reflow. Units should be
properly reflowed in IR Hot Air
convection oven using the
recommended reflow profile. The
direction of board travel does not
matter.
18
l
SOLDER
PASTE
0.152
0.127
mm
t, nominal stencil thickness
Aperture opening for shield pad is 2.8 mm x 2.35 mm as per land dimensions
w, the width of aperture is fixed at 0.70 mm (0.028 inches)
This is to ensure adequate printed
solder paste volume and no
shorting. The following
combination of metal stencil
aperture and metal stencil
thickness should be used:
inches
0.006
0.005
APERTURE AS PER
LAND DIMENSIONS
w
Theta – direction
X – direction
See Fig 4.0
t (STENCIL THICKNESS)
Allowable Misalignment Tolerance
2.8 0.05
3.4 0.05
mm
l, length of aperture
0.2 mm (0.008 inches)
0.110 0.002
0.134 0.002
inches
2 degrees