hcpl-253l-560e Avago Technologies, hcpl-253l-560e Datasheet - Page 5

• Manufacturer Part Number: hcpl-253l-560e
• Description: Lvttl/lvcmos Compatible 3.3 V Optocouplers
• Manufacturer: Avago Technologies

Recommended Pb-Free IR Profile
Solder Reflow Temperature Profile
Regulatory Information
The devices contained in this data sheet have been ap-
proved by the following organizations:
UL
Approval under UL 1577, Component Recognition Pro-
gram, File E55361.
CSA
Approval
Notice #5, File CA 88324.
5
TEMPERATURE
ROOM
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
T
T
smax
smax
smin
300
200
100
25
T
T
p
L
0
under
= 200 °C, T
Note: Non-halide flux should be used.
Note: Non-halide flux should be used.
0
150 - 200 °C
217 °C
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
t 25 °C to PEAK
3 °C/SEC. MAX.
60 to 180 SEC.
smin
CSA
PREHEAT
RAMP-UP
= 150 °C
t
50
s
3°C + 1°C/–0.5°C
260 +0/-5 °C
Component
PREHEATING TIME
150°C, 90 + 30 SEC.
TIME
2.5°C ± 0.5°C/SEC.
100
TIME (SECONDS)
t
t
L
p
Acceptance
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
TEMP.
PEAK
245°C
RAMP-DOWN
6 °C/SEC. MAX.
150
SEC.
SEC.
30
30
50 SEC.
SOLDERING
IEC/EN/DIN EN 60747-5-2
Approved under :
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884Teil 2):2003-01
200°C
TIME
200
PEAK
TEMP.
240°C
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
250