w83627hg Winbond Electronics Corp America, w83627hg Datasheet - Page 112

• Manufacturer Part Number: w83627hg
• Description: Winbond Lpc I/o
• Manufacturer: Winbond Electronics Corp America

CRF7 ° Default 0x00 ± , continued
CRF9 °Default 0x00±
CRFE, FF °Default 0x00±
9.13
CR30 °Default 0x00±
CR60, CR 61 °Default 0x00, 0x00±
These two registers select Hardware Monitor base address [0x100š0xFFF] on 8-byte boundary.
Reserved for Winbond test.
7 - 3
7 - 1
BIT
BIT
BIT
1
0
2
1
0
0
Logical Device B °Hardware Monitor±
IRQIN1EN.
IRQIN0EN.
0š Disable the generation of an SMI /
1š Enable the generation of an SMI /
0š Disable the generation of an SMI /
1š Enable the generation of an SMI /
SMIPME_OEš This is the SMI and
0š Neither SMI nor
1š An SMI or
Reserved. Return zero when read.
PME_ENš Select the power management events to be either an
rupt for the IRQ events. Note thatš this bit is valid only when SMIPME_OE = 1.
0š The power management events will generate an SMI event
1š The power management events will generate an
Reserved.
Reserved.
Logic device activation control
1š Active
0š Inactived
PME
PME
event will be generated.
will be generated. Only the IRQ status bit is set.
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DESCRIPTION
DESCRIPTION
DESCRIPTION
PME
PME
PME
PME
PME
output enable bit.
interrupt due to IRQIN1's IRQ.
interrupt due to IRQIN0's IRQ.
interrupt due to IRQIN1's IRQ.
interrupt due to IRQIN0's IRQ.
W83627HF/ F/ HG/ G
PME
event.
PME
or SMI inter-