adg1433 Analog Devices, Inc., adg1433 Datasheet - Page 17

• Manufacturer Part Number: adg1433
• Description: 4 ? Ron, Triple/quad Spdt ?15 V/+12 V/?5 V Icmos Switches
• Manufacturer: Analog Devices, Inc.

ORDERING GUIDE
Model
ADG1433YRUZ
ADG1433YRUZ-REEL
ADG1433YRUZ-REEL7
ADG1433YCPZ-REEL
ADG1433YCPZ-REEL7
ADG1434YRUZ
ADG1434YRUZ-REEL
ADG1434YRUZ-REEL7
ADG1434YCPZ-REEL
ADG1434YCPZ-REEL7
1
Z = Pb-free part.
1
1
1
1
1
1
1
1
1
1
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
INDICATOR
SEATING
PLANE
COPLANARITY
1.00
0.85
0.80
PIN 1
0.15
0.05
12° MAX
PIN 1
Figure 39. 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Figure 38. 20-Lead Thin Shrink Small Outline Package [TSSOP]
0.10
0.50
BSC
20
BSC SQ
1
BSC
0.65
4.00
VIEW
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-1
TOP
0.30
0.19
4 mm × 4 mm Body, Very Thin Quad (CP-20-1)
COMPLIANT TO JEDEC STANDARDS MO-153-AC
0.80 MAX
0.65 TYP
Description
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
6.60
6.50
6.40
REF
0.20
Dimensions shown in millimeters
Dimensions shown in millimeters
1.20 MAX
BCS SQ
Rev. 0 | Page 17 of 20
3.75
11
10
SEATING
PLANE
0.05 MAX
0.02 NOM
(RU-20)
4.50
4.40
4.30
0.20
0.09
COPLANARITY
6.40 BSC
MAX
0.60
0.75
0.55
0.35
0.08
MAX
0.60
15
11
8°
0°
16
10
0.30
0.23
0.18
INDICATOR
20
6
PIN 1
5
1
0.25 MIN
0.75
0.60
0.45
2.25
2.10 SQ
1.95
ADG1433/ADG1434
EN Pin
Yes
Yes
Yes
Yes
Yes
Yes
Yes
No
No
No
Package Option
RU-16
RU-16
RU-16
CP-16-13
CP-16-13
RU-20
RU-20
RU-20
CP-20-1
CP-20-1