adg1609 Analog Devices, Inc., adg1609 Datasheet - Page 10

• Manufacturer Part Number: adg1609
• Description: 4.5 ? Ron, 4-/8-channel ?5 V,+12 V, +5 V, And +3.3 V Multiplexers
• Manufacturer: Analog Devices, Inc.

ADG1608/ADG1609
Table 10. ADG1609 Pin Function Descriptions
TSSOP
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
N/A
Table 11. ADG1609 Truth Table
A1
X
0
0
1
1
1
X = don’t care.
1
Pin No.
LFCSP
15
16
1
2
3
4
5
6
7
8
9
10
11
12
13
14
EP
Figure 5. ADG1609 Pin Configuration (TSSOP)
S1A
S2A
S3A
S4A
V
DA
EN
A0
SS
Mnemonic
A0
EN
V
S1A
S2A
S3A
S4A
DA
DB
S4B
S3B
S2B
S1B
V
GND
A1
EP
A0
X
0
1
0
1
SS
DD
1
1
4
5
2
3
6
7
8
(Not to Scale)
ADG1609
TOP VIEW
Description
Logic Control Input.
Active High Digital Input. When this pin is low, the device is disabled and all switches are off. When this pin
is high, Ax logic inputs determine on switches.
Most Negative Power Supply Potential. In single-supply applications, this pin can be connected to ground.
Source Terminal 1A. Can be an input or an output.
Source Terminal 2A. Can be an input or an output.
Source Terminal 3A. Can be an input or an output.
Source Terminal 4A. Can be an input or an output.
Drain Terminal A. Can be an input or an output.
Drain Terminal B. Can be an input or an output.
Source Terminal 4B. Can be an input or an output.
Source Terminal 3B. Can be an input or an output.
Source Terminal 2B. Can be an input or an output.
Source Terminal 1B. Can be an input or an output.
Most Positive Power Supply Potential.
Ground (0 V) Reference.
Logic Control Input.
Exposed Pad. The exposed pad is connected internally. For increased reliability of the solder joints and
maximum thermal capability, it is recommended that the pad be soldered to the substrate, V
16
14
15
13
12
11
10
9
A1
GND
V
S1B
S2B
S3B
S4B
DB
DD
EN
0
1
1
1
1
Rev. 0 | Page 10 of 20
On Switch Pair
None
1
2
3
4
Figure 6. ADG1609 Pin Configuration (LFCSP)
S1A
S2A
S3A
V
NOTES
1. THE EXPOSED PAD IS CONNECTED
SS
INTERNALLY. FOR INCREASED
RELIABILITY OF THE SOLDER
JOINTS AND MAXIMUM THERMAL
CAPABILITY, IT IS RECOMMENDED
THAT THE PAD BE SOLDERED TO
THE SUBSTRATE, V
1
2
3
4
(Not to Scale)
ADG1609
TOP VIEW
PIN 1
INDICATOR
SS
.
12 V
11 S1B
10 S2B
9 S3B
DD
SS
.