adg1609 Analog Devices, Inc., adg1609 Datasheet - Page 18

• Manufacturer Part Number: adg1609
• Description: 4.5 ? Ron, 4-/8-channel ?5 V,+12 V, +5 V, And +3.3 V Multiplexers
• Manufacturer: Analog Devices, Inc.

ADG1608/ADG1609
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
ADG1608BRUZ
ADG1608BRUZ-REEL7
ADG1608BCPZ-REEL7
ADG1609BRUZ
ADG1609BRUZ-REEL7
ADG1609BCPZ-REEL7
1
Z = RoHS Compliant Part.
1
1
1
1
1
1
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
INDICATOR
SEATING
PLANE
0.80
0.75
0.70
PIN 1
0.15
0.05
4.50
4.40
4.30
PIN 1
Figure 37. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
Figure 36. 16-Lead Thin Shrink Small Outline Package [TSSOP]
BSC
0.65
TOP VIEW
16
3.10
3.00 SQ
2.90
1
COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-220-WEED.
Package Description
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
COMPLIANT TO JEDEC STANDARDS MO-153-AB
3 mm x 3 mm Body, Very Very Thin Quad
5.10
5.00
4.90
0.10
Dimensions shown in millimeters
Dimensions shown in millimeters
0.30
0.19
9
8
Rev. 0 | Page 18 of 20
1.20
MAX
SEATING
PLANE
0.20 REF
BSC
6.40
(CP-16-22)
0.50
0.40
0.30
(RU-16)
BSC
0.50
0.05 MAX
0.02 NOM
COPLANARITY
0.20
0.09
0.08
12
9
0.30
0.23
0.18
13
8
BOTTOM VIEW
EXPOSED
8°
0°
PAD
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
16
5
1
4
0.20 MIN
1.75
1.60 SQ
1.55
0.75
0.60
0.45
Package
Option
RU-16
RU-16
CP-16-22
RU-16
RU-16
CP-16-22
Branding
S38
S39