74ahct02pw NXP Semiconductors, 74ahct02pw Datasheet
74ahct02pw
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74ahct02pw Summary of contents
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... Ordering information Table 1. Ordering information Type number Package Temperature range Name 74AHC02D +125 C 74AHCT02D 74AHC02PW +125 C 74AHCT02PW 74AHC02BQ +125 C 74AHCT02BQ CC Description SO14 plastic small outline package; 14 leads; body width 3.9 mm TSSOP14 plastic thin shrink small outline package; 14 leads; body width 4.4 mm DHVQFN14 plastic dual in-line compatible thermal enhanced very thin quad fl ...
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... NXP Semiconductors 4. Functional diagram mna216 Fig 1. Logic symbol 5. Pinning information 5.1 Pinning GND 7 Fig 4. Pin configuration SO14 and TSSOP14 5.2 Pin description Table 2. Pin description ...
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... NXP Semiconductors Table 2. Pin description …continued Symbol Pin GND Functional description [1] Table 3. Function table Input [ HIGH voltage level LOW voltage level don’t care 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134) ...
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... NXP Semiconductors 8. Recommended operating conditions Table 5. Recommended operating conditions Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage CC V input voltage I V output voltage O T ambient temperature amb t/ V input transition rise and fall rate 9. Static characteristics Table 6. Static characteristics Voltages are referenced to GND (ground = 0 V) ...
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... NXP Semiconductors Table 6. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions For type 74AHCT02 V HIGH-level input voltage V LOW-level input voltage V HIGH-level output voltage 8 LOW-level ...
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... NXP Semiconductors Table 7. Dynamic characteristics GND = 0 V; For test circuit see Figure Symbol Parameter Conditions For type 74AHCT02 t propagation nA nY; see pd delay power pF dissipation V = GND capacitance [1] Typical values are measured at nominal supply voltage (V ...
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... NXP Semiconductors PULSE GENERATOR Test data is given in Table 9. Definitions test circuit Termination resistance should be equal to output impedance Load capacitance including jig and probe capacitance Load resistance Test selection switch. Fig 7. Load circuit for switching times Table 9. Test data ...
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... NXP Semiconductors 12. Package outline SO14: plastic small outline package; 14 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.01 0.069 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2 0.85 mm terminal 1 index area terminal 1 index area DIMENSIONS (mm are the original dimensions) (1) A UNIT max. 0.05 0. 0.2 0.00 0.18 Note 1 ...
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... Document ID Release date 74AHC_AHCT02_3 20080107 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Section • Section • ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Functional description . . . . . . . . . . . . . . . . . . . 3 7 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 13 Abbreviations ...