EL5611 Intersil Corporation, EL5611 Datasheet - Page 12

• Manufacturer Part Number: EL5611
• Description: 6-Channel Vcom Amplifierthe EL5611 And EL5811 Are Low Power, High Voltage Rail-to-rail Inputoutput Amplifiers Targeted Primarily at Vcom Applications in Tft-lcd Displays. The EL5611 Contains Six Amplifiers, And The EL5811 Contains Eight Amplifiers. O
• Manufacturer: Intersil Corporation

when sourcing, and:
P
when sinking,
where:
• i = 1 to 6 for EL5611 and 1 to 8 for EL5811
• V
• I
• V
• I
If we set the two P
can solve for R
and 30 provide a convenient way to see if the device will
overheat. The maximum safe power dissipation can be
found graphically, based on the package type and the
ambient temperature. By using the previous equation, it is a
simple matter to see if P
derating curves. To ensure proper operation, it is important
to observe the recommended derating curves shown in
Figures 29 & 30.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
DMAX
FIGURE 29. PACKAGE POWER DISSIPATION vs AMBIENT
SMAX
LOAD
S
OUT
= Total supply voltage
=
i = Maximum output voltage of the application
i = Load current
= Maximum supply current per amplifier
3.5
2.5
1.5
0.5
Σi V
3
2
1
0
[
0
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD - HTSSOP
EXPOSED DIEPAD SOLDERED TO PCB PER
JESD51-5
TEMPERATURE
3.030W
S
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
LOAD
×
I
SMAX
DMAX
25
θ
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
HTSSOP24
AMBIENT TEMPERATURE (°C)
JA
i to avoid device overheat. Figures 29
=33°C/W
For information regarding Intersil Corporation and its products, see www.intersil.com
+
DMAX
3.333W
equations equal to each other, we
50
(
V
OUT
12
exceeds the device's power
75
i V
θ
HTSSOP28
JA
–
85
=30°C/W
S
- )
100
×
I
LOAD
125
i
]
150
EL5611, EL5811
Unused Amplifiers
It is recommended that any unused amplifiers in a dual and
a quad package be configured as a unity gain follower. The
inverting input should be directly connected to the output
and the non-inverting input tied to the ground plane.
Power Supply Bypassing and Printed Circuit
Board Layout
The EL5611 and EL5811 can provide gain at high frequency.
As with any high-frequency device, good printed circuit
board layout is necessary for optimum performance. Ground
plane construction is highly recommended, lead lengths
should be as short as possible and the power supply pins
must be well bypassed to reduce the risk of oscillation. For
normal single supply operation, where the V
connected to ground, a 0.1µF ceramic capacitor should be
placed from V
capacitor should then be connected in parallel, placed in the
region of the amplifier. One 4.7µF capacitor may be used for
multiple devices. This same capacitor combination should be
placed at each supply pin to ground if split supplies are to be
used.
FIGURE 30. PACKAGE POWER DISSIPATION vs AMBIENT
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
1
0
0
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
TEMPERATURE
833mW
S
+ to pin to V
θ
25
HTSSOP24
JA
AMBIENT TEMPERATURE (°C)
=120°C/W
909mW
50
S
- pin. A 4.7µF tantalum
75
θ
HTSSOP28
JA
85
=110°C/W
100
S
125
- pin is
August 3, 2005
150
FN7355.1