tea1094a NXP Semiconductors, tea1094a Datasheet - Page 21

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tea1094a

Manufacturer Part Number
tea1094a
Description
Hands Free Ic
Manufacturer
NXP Semiconductors
Datasheet

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Philips Semiconductors
PACKAGE OUTLINES
DIP28: plastic dual in-line package; 28 leads (600 mil)
1996 Jul 15
handbook, full pagewidth
Hands free IC
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
Note
inches
UNIT
mm
SOT117-1
VERSION
OUTLINE
L
Z
max.
0.20
28
5.1
1
A
pin 1 index
0.020
min.
0.51
A
1
051G05
IEC
max.
0.16
4.0
A
2
0.066
0.051
1.7
1.3
b
e
MO-015AH
D
0.020
0.014
0.53
0.38
JEDEC
b
1
REFERENCES
0.013
0.009
0.32
0.23
c
0
b
36.0
35.0
1.41
1.34
D
(1)
scale
EIAJ
21
5
14.1
13.7
0.56
0.54
E
(1)
15
b
14
1
10 mm
2.54
0.10
e
A
1
w
E
M
A
15.24
2
0.60
e
1
A
0.15
0.13
3.9
3.4
L
TEA1094; TEA1094A
PROJECTION
EUROPEAN
c
15.80
15.24
0.62
0.60
M
E
17.15
15.90
0.68
0.63
M
(e )
M
Product specification
M
H
1
H
E
ISSUE DATE
0.25
0.01
92-11-17
95-01-14
w
SOT117-1
max.
0.067
1.7
Z
(1)

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