tea1566s NXP Semiconductors, tea1566s Datasheet - Page 19

• Manufacturer Part Number: tea1566s
• Description: Greenchip; Smps Module
• Manufacturer: NXP Semiconductors

Philips Semiconductors
1999 Apr 20
DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12 mm)
GreenChip ; SMPS module
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
OUTLINE
VERSION
SOT157-2
17.0
15.5
A
1
Z
A
4.6
4.2
2
0.75
0.60
b
p
e
1
0.48
0.38
IEC
c
e
24.0
23.6
D
D
d
(1)
20.0
19.6
d
b
p
JEDEC
D
10
h
w
12.2
11.8
REFERENCES
E
M
(1)
9
5.08
0
e
j
2.54
e
scale
1
EIAJ
19
5
5.08
e
2
non-concave
E h
10 mm
E
6
h
L
x
3.4
3.1
B
L
j
3
12.4
11.0
Q
L
view B: mounting base side
A
m
2
2.4
1.6
L
3
PROJECTION
e
4.3
EUROPEAN
m
c
2
D
h
E
2.1
1.8
Q
A
Preliminary specification
0.8
v
v
M
0.25
TEA1566
w
ISSUE DATE
95-03-11
97-12-16
0.03
x
SOT157-2
2.00
1.45
Z
(1)