tda6107ajf-n1 NXP Semiconductors, tda6107ajf-n1 Datasheet - Page 13

• Manufacturer Part Number: tda6107ajf-n1
• Description: Tda6107ajf Triple Video Output Amplifier
• Manufacturer: NXP Semiconductors

Philips Semiconductors
13. Handling information
14. Soldering
9397 750 14728
Product data sheet
14.1 Introduction to soldering through-hole mount packages
14.2 Soldering by dipping or by solder wave
14.3 Manual soldering
14.4 Package related soldering information
Inputs and outputs are protected against electrostatic discharge in normal handling.
However, to be completely safe, it is desirable to take normal precautions appropriate to
handling integrated circuits.
This text gives a brief insight to wave, dip and manual soldering. A more in-depth account
of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of through-hole mount IC packages
on a printed-circuit board.
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing. Typical dwell time of the leads in the wave ranges from
3 seconds to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb
or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic
body must not exceed the specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is
less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is
between 300 C and 400 C, contact may be up to 5 seconds.
Table 6:
[1]
[2]
Package
CPGA, HCPGA
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
For PMFP packages hot bar soldering or manual soldering is suitable.
[2]
Suitability of through-hole mount IC packages for dipping and wave soldering
methods
Rev. 02 — 28 April 2005
Soldering method
Dipping
suitable
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Triple video output amplifier
TDA6107AJF
Wave
suitable
suitable
not suitable
stg(max)
[1]
). If the
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