cbt3257ads NXP Semiconductors, cbt3257ads Datasheet
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... Latch-up testing is done to JEDEC standard JESD78 which exceeds 100 mA 3. Ordering information Table +85 C. amb Type number Topside CBT3257AD CBT3257ADB 3257A CBT3257ADS CT3257A CBT3257APW CT3257A [1] Also known as QSOP16. switch connection between two ports Ordering information Package mark Name CBT3257AD ...
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... NXP Semiconductors 4. Functional diagram Fig 1. Logic diagram of CBT3257A (positive logic) CBT3257A_2 Product data sheet Quad 1-of-2 multiplexer/demultiplexer Rev. 02 — 4 July 2007 CBT3257A 2 1B1 3 1B2 5 2B1 6 2B2 11 3B1 10 3B2 14 4B1 13 4B2 002aab779 © NXP B.V. 2007. All rights reserved. ...
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... GND 3A 002aab768 4B1 4B2 CBT3257ADS 3B1 3B2 002aab770 (QSOP16) Pin description Pin Description 1 select control input outputs 10, 11, 13 inputs 8 ground (0 V) ...
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... NXP Semiconductors 6. Functional description Refer to 6.1 Function table Table HIGH voltage level LOW voltage level Don’t care. Inputs Limiting values Table 4. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol CCC stg [1] The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed ...
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... NXP Semiconductors 9. Static characteristics Table 6. Static characteristics +85 C. amb Symbol Parameter V input clamping voltage IK V pass voltage pass I input leakage current LI I supply current CC I additional supply current CC C input capacitance I C off-state input/output capacitance io(off) R ON-state resistance on [1] ...
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... NXP Semiconductors 10.1 AC waveforms V = GND to 3 and t PLZ t and t PZL t and t PLH Fig 6. Input to output propagation delays (1) Waveform 1 is for an output with internal conditions such that the output is LOW except when (2) Waveform 2 is for an output with internal conditions such that the output is HIGH except when Fig 7 ...
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... NXP Semiconductors 11. Test information Fig 8. Test circuit Table 8. Test PLZ PZL PHZ PZH CBT3257A_2 Product data sheet DUT output Test data are given in Table 8. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz ...
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... NXP Semiconductors 12. Package outline SO16: plastic small outline package; 16 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors SSOP16: plastic shrink small outline package; 16 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.21 1. 0.25 0.05 1.65 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION IEC SOT338-1 Fig 10 ...
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... NXP Semiconductors SSOP16: plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.25 1.55 mm 1.73 0.25 0.10 1.40 Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION IEC SOT519-1 Fig 11 ...
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... NXP Semiconductors TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...
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... Release date CBT3257A_2 20070704 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Table • Soldering information removed. ...
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... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...
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... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Functional description . . . . . . . . . . . . . . . . . . . 4 6.1 Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 10.1 AC waveforms Test information . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 Package outline ...