at24c02c ATMEL Corporation, at24c02c Datasheet
at24c02c
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at24c02c Summary of contents
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... Die Sales: Wafer Form and Tape and Reel Description The AT24C02C provides 2048 bits of serial electrically erasable and programmable read-only memory (EEPROM) organized as 256 words of 8 bits each. The device is optimized for use in many industrial and commercial applications where low-power and low-voltage operation are essential ...
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... DEVICE/PAGE ADDRESSES (A2, A1, A0): The A2, A1 and A0 pins are device address inputs that are hard wired for the AT24C02C. As many as eight 2K devices may be addressed on a sin- gle bus system (device addressing is discussed in detail under the Device Addressing section). WRITE PROTECT (WP): The AT24C02C has a write protect pin that provides hardware data protection ...
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... Table 1-1. WP Pin Status GND 2. Memory Organization AT24C02C, 2K SERIAL EEPROM: Internally organized with 32 pages of 8 bytes each, the 2K requires an 8-bit data word address for random word addressing. 8700B–DEEPR–2/10 Table 1-1. Write Protect Part of the Array Protected 24C02C ...
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... LOW t Clock Pulse Width High HIGH t Noise Suppression Time I t Clock Low to Data Out Valid AA t Time the bus must be free before a new transmission can start BUF AT24C02C [Preliminary 25 1.0 MHz SCL 40C to +85C, V – AI Test Condition ...
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... Stop Setup Time SU.STO t Data Out Hold Time DH t Write Cycle Time WR (1) Endurance 5.0V, 25C, Byte Mode Note: 1. This parameter is ensured by characterization only. 8700B–DEEPR–2/10 AT24C02C [Preliminary] = 40C to +85 +1.7V to +5.5V TTL Gate and – 1.7, 2.5, 2.7 Min Max 0.6 0.6 0 100 ...
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... EEPROM in 8-bit words. The EEPROM sends a zero to acknowledge that it has received each word. This happens during the ninth clock cycle. STANDBY MODE: The AT24C02C features a low-power standby mode which is enabled: (a) upon power-up and (b) after the receipt of the STOP bit and the completion of any internal operations ...
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... WR 8700B–DEEPR–2/10 ® t HIGH LOW LOW t t HD.STA HD.DAT t AA ACK t wr STOP CONDITION AT24C02C [Preliminary SU.DAT t DH (1) START CONDITION SU.STO t BUF 7 ...
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... Figure 5-2. Data Validity SDA SCL Figure 5-3. Start and Stop Definition SDA SCL Figure 5-4. Output Acknowledge SCL DATA IN DATA OUT AT24C02C [Preliminary] 8 DATA STABLE DATA STABLE DATA CHANGE START 1 START STOP 8 9 ACKNOWLEDGE 8700B–DEEPR–2/10 ...
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... The read/write bit is representative of the operation desired. Only if the internal write cycle has completed will the EEPROM respond with a zero allowing the read or write sequence to continue. 8700B–DEEPR–2/10 AT24C02C [Preliminary] Figure 8-1 the nonvolatile memory. All inputs are disabled during this ...
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... The sequential read operation is terminated when the microcontroller does not respond with a zero but does generate a following stop condition (see Figure 8-1. Device Address AT24C02C [Preliminary] 10 Figure 8-5 on page 12). Figure 8-6 on page ...
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... Figure 8-2. Byte Write Figure 8-3. Page Write Figure 8-4. Current Address Read 8700B–DEEPR–2/10 AT24C02C [Preliminary] 11 ...
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... Figure 8-5. Random Read Figure 8-6. Sequential Read AT24C02C [Preliminary] 12 8700B–DEEPR–2/10 ...
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... AT24C02C Catalog Numbering Scheme Atmel Designator Product Family Device Density Device Revision 8700B–DEEPR–2/ AT24C02C [Preliminary] Shipping Carrier Option B or blank = Bulk (tubes Tape and Reel Operating Voltage M = 1.7V to 5.5V Package Device Grade or Wafer/Die Thickness ...
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... AT24C02C Ordering Information Ordering Code AT24C02C-PUM (Bulk form only) (1) AT24C02C-SSHM-B (NiPdAu Lead Finish) (2) AT24C02C-SSHM-T (NiPdAu Lead Finish) (2) AT24C02C-XHM-T (NiPdAu Lead Finish) (1) AT24C02C-XHM-B (NiPdAu Lead Finish) (2) AT24C02CY6-MAHM-T (NiPdAu Lead Finish) (2) AT24C02C-TSUM-T (2) AT24C02CU3-CUM-T (3) AT24C02C-W-11M Notes: 1. “-B” denotes bulk. 2. “-T” denotes tape and reel. SOIC = 4K per reel. TSSOP, UDFN, SOT23, and VFBGA = 5K per reel. ...
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... Pin 1 Indicator (Dot Material Set Y = Seal Year WW = Seal Week 02C = Device M = Voltage Indicator *Lot Number to Use ALL Characters in Marking BOTTOM MARK 8700B–DEEPR–2/10 Seal Year | Seal Week | | Lot Number No Bottom Mark AT24C02C [Preliminary ...
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... TOP MARK |---|---|---|---|---|---|---|---| A |---|---|---|---|---|---|---|---| 0 |---|---|---|---|---|---|---|---| * |---|---|---|---|---|---|---|---| | Pin 1 Indicator (Dot Material Set Y = Seal Year WW = Seal Week 02C = Device M = Voltage Indicator *Lot Number to Use ALL Characters in Marking BOTTOM MARK AT24C02C [Preliminary] 16 Seal Year | Seal Week | | | Lot Number No Bottom Mark 8700B–DEEPR–2/10 ...
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... TOP MARK Pin 1 Indicator (Dot) | |---|---|---|---| * |---|---|---|---|---| |---|---|---|---|---| H = Material Set Y = Seal Year WW = Seal Week 02C = Device M = Voltage Indicator BOTTOM MARK |---|---|---|---|---|---|---| |---|---|---|---|---|---|---| |---|---|---|---|---|---|---| Lot Number XX = Country of Origin AAAAAA = Lot Number 8700B–DEEPR–2/ <- Pin 1 Indicator AT24C02C [Preliminary] 17 ...
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... M = Voltage Indicator W = Write Protect Feature U = Material Set BOTTOM MARK |---|---|---|---| Y |---|---|---|---| Y = One Digit Year Code M = Seal Month TC = Trace Code UDFN TOP MARK 02C = Device H = Material Set M = Voltage Indicator Y = Year of Assembly TC = Trace Code AT24C02C [Preliminary] 18 |---|---|---|---|---| |---|---|---|---|---| * | Pin 1 Indicator (Dot |---|---|---| |---|---|---| ...
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... VFBGA TOP MARK LINE 1-------> LINE 2-------> 02C = Device U = Material Set Y = One Digit Year Code M = Seal Month TC = Trace Code 8700B–DEEPR–2/10 AT24C02C [Preliminary] 02CU YMTC |<-- Pin 1 This Corner 19 ...
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... Packaging Information 8P3 – PDIP AT24C02C [Preliminary] 20 8700B–DEEPR–2/10 ...
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... Colorado Springs, CO 80906 R 8700B–DEEPR–2/ TITLE 8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC) AT24C02C [Preliminary Ø Ø END VIEW COMMON DIMENSIONS (Unit of Measure = mm) MIN NOM MAX SYMBOL A1 0.10 – ...
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... Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07 mm. 5. Dimension D and determined at Datum Plane H. Package Drawing Contact: packagedrawings@atmel.com AT24C02C [Preliminary TITLE 8A2, 8-lead, 4 ...
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... Soldering the large thermal pad is optional, but not recommended. No electrical connection is accomplished to the device through this pad soldered it should be tied to ground Package Drawing Contact: packagedrawings@atmel.com 8700B–DEEPR–2/10 AT24C02C [Preliminary ...
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... The dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and an adjacent lead shall not be less than 0.07 mm. This drawing is for general information only. Refer to JEDEC Drawing MO-193, Variation AB for additional information. Package Drawing Contact: packagedrawings@atmel.com AT24C02C [Preliminary ...
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... VFBGA 8700B–DEEPR–2/10 AT24C02C [Preliminary] 25 ...
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... Revision History Doc. Rev. 8700B 8700A AT24C02C [Preliminary] 26 Date Comments 02/2010 Corrected Catalog Numbering Scheme and Ordering Information 12/2009 Initial Document Release 8700B–DEEPR–2/10 ...
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... Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel’s products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life. © 2010 Atmel Corporation. All rights reserved. Atmel Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others. International Atmel Asia ...