w25q16bv Winbond Electronics Corp America, w25q16bv Datasheet - Page 62

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w25q16bv

Manufacturer Part Number
w25q16bv
Description
16m-bit Serial Flash Memory With Dual And Quad Spi
Manufacturer
Winbond Electronics Corp America
Datasheet

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12.4 16-Pin SOIC 300-mil (Package Code SF)
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
SYMBOL
E1
D
e
A1
C
A
E
b
L
y
(2)
(3)
(3)
10.08
10.01
2.36
0.10
0.33
0.18
7.39
0.39
MIN
MILLIMETERS
---
0
o
1.27 BSC
10.49
10.64
0.076
MAX
0.51
0.28
7.59
1.27
2.64
0.30
8
- 62 -
o
0.093
0.004
0.013
0.007
0.397
0.394
0.291
0.015
MIN
---
0
0.050 BSC
o
INCHES
0.104
0.012
0.020
0.011
0.413
0.419
0.299
0.050
0.003
MAX
8
o
W25Q16BV

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