lm26484sqx National Semiconductor Corporation, lm26484sqx Datasheet - Page 5

• Manufacturer Part Number: lm26484sqx
• Description: Power Management Unit
• Manufacturer: National Semiconductor Corporation

V
T
C
I
V
V
V
PSRR
T
C
C
q
SD
ON
IN
IN
OUT
FB
IN
FB
OUT
Absolute Maximum Ratings
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
General Electrical Characteristics
Typical values and limits appearing in normal type apply for T
junction temperature range for operation, −40°C to +125°C. (Notes 2, 7)
LDO Controller
Unless otherwise noted, AVDD = AVIN 3.3V, PVIN = 1.8V. Typical values and limits appearing in normal type apply for T
C. Limits appearing in boldface type apply over the entire junction temperature range for operation, −40°C to +125°C. (Notes 2,
7)
VIN1, VIN2, AVDD, AVIN
nPOR, ENSW1, FB1, ENSW2, FB2,
ENLDO, LDO_FB
GND to GND SLUG
Junction Temperature (T
Storage Temperature Range
Maximum Lead Temperature (Soldering)
ESD Ratings
Symbol
Symbol
Human Body Model (Note 4)
Machine Model:
VIN1,2; SW1,2 PGND1,2
All other pins
Operational Voltage Range
Thermal Shutdown
Input Capacitor
Quiescent Current “Off”
Operational Voltage Range
NMOS configuration
Feedback Voltage Accuracy
Power Supply Ripple Rejection
Turn On Time
Feedback Capacitor
Output Capacitor
C10, (Note 1)
J-MAX
Parameter
Parameter
)
−0.3 to VIN + 0.3V
−65°C to +150°C
−0.3V to +6V
(Notes 1, 2)
AVDD, AVIN
(Note 3)
C9, Figure 1
VIN = 3.3V,
ENSW1, ENSW2, ENLDO = 0
150°C
260°C
±0.3V
150V
200V
2 kV
AVIN LDO internal circuits
Externally configured
F = 10 kHz, Load Current = I
Start up from shut-down
C11, Figure 1
Capacitance for stability:
−40°C
ESR (Equivalent Series
Resistance)
J
= 25°C. Limits appearing in boldface type apply over the entire
5
≤
Conditions
T
Conditions
J
Operating Ratings:
Thermal Properties
VIN1, VIN2, AVDD, AVIN
nPOR, ENSW1, ENSW2, ENLDO,
LDO_GATE, SW1, SW2
FB1, FB2
LDOFB
Power Dissipation (P
T
Junction Temperature (T
(Note 3)
Junction-to-Ambient
Thermal Resistance
(θ
Junction-to-Case
Thermal Resistance (θ
≤
A
JA
125°C
= 85°C, T
)
MAX
= 125°C
MAX
D-MAX
JC
Min
−1.5
J
)
3.0
Min
3.0
0.8
−2
10
) Range
)
(Notes 5, 6)
0.03
Typ
160
Typ
−30
500
3.3
3.3
0.5
0.5
10
12
22
33.1°C/W based on a
VBuck2 respectively
0v to VBuck1 and
4-layer 1 oz. PCB
−40°C to +125°C
0V to V
Max
Max
5.5
1.5
1.5
5.5
3.0V to 5.5V
2
1
www.national.com
0v to V
IN
4.3°C/W
A
+ 0.3V
= 25°
1.2W
Units
Units
µsec
LDO
µA
dB
pF
µF
°C
µF
%
Ω
V
V
V
V