stm8af6148 STMicroelectronics, stm8af6148 Datasheet - Page 81

• Manufacturer Part Number: stm8af6148
• Description: Automotive 8-bit Mcu, With Up To 32 Kbytes Flash, Eeprom, 10-bit Adc, Timers, Lin, Spi, I 2c, 3 V To 5.5 V
• Manufacturer: STMicroelectronics

STM8AF61xx STM8AH61xx
11.4
11.4.1
Thermal characteristics
The maximum chip junction temperature (T
Table 16: General operating conditions on page 51
The maximum chip-junction temperature, T
using the following equation:
Where:
Table 41.
1. Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection
Reference document
JESD51-2 integrated circuits thermal test method environment conditions - natural
convection (still air). Available from www.jedec.org.
environment.
Symbol
–
–
–
–
–
Θ
Θ
JA
JA
T
Θ
P
P
chip internal power.
P
Where:
P
taking into account the actual V
in the application.
Amax
JA
Dmax
INTmax
I/Omax
I/Omax
Thermal characteristics
is the package junction-to-ambient thermal resistance in ° C/W
Thermal resistance junction-ambient
LQFP 48 - 7 x 7 mm
Thermal resistance junction-ambient
LQFP 32 - 7 x 7 mm
is the maximum ambient temperature in ° C
is the sum of P
= Σ (V
represents the maximum power dissipation on output pins
is the product of I
OL
*I
OL
) + Σ ((V
T
INTmax
Jmax
Parameter
DD
= T
DD
(1)
and P
and V
Amax
-V
OL
OH
Jmax
/I
Jmax
I/Omax
DD
OL
)*I
+ (P
, expressed in Watts. This is the maximum
and V
) must never exceed the values given in
, in degrees Celsius, may be calculated
OH
Dmax
),
.
(P
OH
Dmax
x Θ
/I
OH
JA
= P
)
of the I/Os at low and high level
INTmax
Electrical characteristics
+ P
Value
57
59
I/Omax
)
°C/W
°C/W
Unit
81/90