tza3043 NXP Semiconductors, tza3043 Datasheet - Page 19

• Manufacturer Part Number: tza3043
• Description: Gigabit Ethernet/fibre Channel Transimpedance Amplifier
• Manufacturer: NXP Semiconductors

Philips Semiconductors
BONDING PAD LOCATIONS
Note
1. All coordinates are referenced, in m, to the bottom left-hand corner of the die.
2000 Mar 28
DREF
GND
GND
IPhoto
GND
GND
GND
GND
OUT
OUTQ
V
V
AGC
CC
CC
Gigabit Ethernet/Fibre Channel
transimpedance amplifier
1300
Fig.24 Bonding pad locations of the TZA3043U.
m
IPhoto
SYMBOL
DREF
x
GND
GND
0
y
0
2
4
1
3
5
13
TZA3043U
6
12
PAD TZA3043U
1030
m
7
11
10
11
12
13
1
2
3
4
5
6
7
8
9
8
10
9
OUTQ
OUT
MGU099
PAD TZA3043BU
10
11
12
13
19
1
2
3
4
5
6
7
8
9
1300
Fig.25 Bonding pad locations of the TZA3043BU.
m
IPhoto
DREF
GND
GND
x
0
y
0
2
4
1
3
5
215
360
549
691
785
785
567
424
259
95
95
95
95
13
x
TZA3043; TZA3043B
TZA3043BU
COORDINATES
6
12
1030
m
7
11
Product specification
8
10
(1)
9
1055
1055
1055
881
618
473
285
501
641
95
95
95
95
y
OUT
OUTQ
MGU100