lm2706 National Semiconductor Corporation, lm2706 Datasheet - Page 2

• Manufacturer Part Number: lm2706
• Description: Miniature, Variable, Step-down Dc-dc Converter With Bypass For Rf Power Amplifiers
• Manufacturer: National Semiconductor Corporation

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Connection Diagrams
Ordering Information
Pin Description
Number
Pin
C1
D1
D2
D3
C3
A1
B1
B3
A3
A2
10-Bump micro SMD Package
Pin Name
PGND
SGND
V
ABD
BYP
PV
V
SW
EN
FB
CON
DD
(*) XY - denotes the date code marking (2 digit) in production
TT - refers to die run/lot traceability for production
I - pin one indication
S - Product line designator
Note the Package Marking may change over the course of production without notice
IN
Order Number
LM2706TLX
Top View
LM2706TL
Analog Supply Input. If board layout is not optimum, an optional 0.1 µF ceramic capacitor is
suggested ( Figure 1 ).
Voltage Control Analog Input. V
V
0.65V
V
Automatic Bypass Disable. Use this digital input to control Automatic Bypass mode. Set:
ABD = low to enable automatic bypass mode
ABD = high to disable automatic bypass mode
Bypass. Use this digital input to command operation in Forced Bypass mode. Set BYP = 0V
for normal operation.
Enable Input. Set this digital input high for normal operation. For shutdown, set low.
Power Ground
Switching Node connection to the internal PFET switch and NFET synchronous rectifier.
Power Supply Voltage Input to the internal PFET switch. Connect to the input filter capacitor
( Figure 1 ).
Feedback Analog Input. Connect to the output at the output filter capacitor ( Figure 1 ).
Analog and Control Ground
CON
CON
≤ 0.55V for V
≥ 1.7V for V
<
V
CON
20040902
Level Chip Scale
10-Bump Wafer
Package Type
<
(micro SMD)
1.5V for V
OUT
OUT
= 3.25V
= 1.5V
OUT
CON
= 1.75 V
NSC Package
2
XYTT IS64B
Marking (*)
controls V
CON
Function
+ 0.45V
OUT
in PWM mode. Set:
10-Bump micro SMD Package
3000 Tape and Reel
250 Tape and Reel
Supplied As
Bottom View
20040903