buk218-50dc NXP Semiconductors, buk218-50dc Datasheet
buk218-50dc
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buk218-50dc Summary of contents
Page 1
... FUNCTIONAL BLOCK DIAGRAM INPUT 1 INPUT 2 STATUS CONTROL & PROTECTION CIRCUITS GROUND RG Fig.1. Elements of the TOPFET dual HSS with internal ground resistor. PIN CONFIGURATION Fig Product specification BUK218-50DC MIN. UNIT 8 MAX. UNIT 50 16 150 ˚C = 25˚ BATT LOAD 1 ...
Page 2
... 150˚C prior to turn-off j CONDITIONS Human body model 250 pF 1 allowed as an overload condition but at the threshold Product specification BUK218-50DC MIN. MAX. UNIT 83.3 W -55 175 ˚C -40 150 ˚ ...
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... 85˚ -200 mA 300 5 tests are continuous. The specified pulse duration t 3 Product specification BUK218-50DC MIN. TYP. - 2.4 - 1.2 MIN. TYP 5 25˚C - ...
Page 4
... 1 25˚C. mb CONDITIONS open circuit detected, other channel off 3 input low to status low = 5 V ext 4 Product specification BUK218-50DC MIN. TYP. MAX. UNIT 20 60 160 A 5 1.2 1 0.15 0.3 0 100 ...
Page 5
... 125˚C prior to overload mb 4 for protection which determines trip time < P and T < D(TO) j j(TO) according to the exponential model formula Product specification BUK218-50DC . TRUTH TABLE MIN. TYP. MAX. 2 4.2 0 25˚C unless otherwise stated. mb MIN. TYP. MAX. ...
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... OFF OFF OFF OFF OFF OFF OFF undervoltage OV overvoltage OC open circuit SC short circuit OT overtemperature 6 Product specification BUK218-50DC TRUTH TABLE MIN. TYP. MAX. 5.5 7 8.5 - 0 25˚ DESCRIPTION both off & normal both off, one/both OC or short to V+ one off & ...
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... V L 30 from input going low to 90 70 CONDITIONS Product specification BUK218-50DC MIN. TYP. MAX. UNIT - 0 100 400 0 ...
Page 8
... For soldering guidelines and SMD footprint design, please refer to Data Handbook SC18. October 2001 2 scale max. 0.64 1.60 10.30 2.90 15.80 11 1.27 0.46 2.10 14.80 1.20 9.70 REFERENCES JEDEC EIAJ 1 , centre pin connected to mounting base. 8 Product specification BUK218-50DC 2 -PAK); SOT427 mounting base 2.60 2.20 EUROPEAN ISSUE DATE PROJECTION 99-06-25 01-04-18 Rev 2.010 ...
Page 9
... This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A 9 Product specification BUK218-50DC Rev 2.010 ...