vn772kp-e STMicroelectronics, vn772kp-e Datasheet - Page 25

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vn772kp-e

Manufacturer Part Number
vn772kp-e
Description
Quad Smart Power Solid State Relay For Complete H-bridge Configurations
Manufacturer
STMicroelectronics
Datasheet

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VN772KP-E
4
4.1
Figure 47. SO-28 PC board
Note:
Thermal data
SO-28 thermal data
Layout condition of Rth and Zth measurements (PCB FR4 area = 58mm x 58mm, PCB
thickness = 2mm, Cu thickness = 35µm, Copper areas: from minimum pad layout to 6cm
Figure 48. Chipset configuration
Figure 49. Auto and mutual Rthj-amb vs PCB copper area in open box free air
a. see definitions in
LOW SIDE
channel 3
CHIP
condition
R
thB
Section 5.3 on page 31
(a)
R
thAB
Doc ID 022022 Rev 1
HIGH SIDE
channel 1,2
R
CHIP
R
thBC
thA
R
thAC
LOW SIDE
channel 4
CHIP
R
Thermal data
thC
25/33
2
).

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