pip3115-b NXP Semiconductors, pip3115-b Datasheet - Page 5

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pip3115-b

Manufacturer Part Number
pip3115-b
Description
Logic Level Topfet
Manufacturer
NXP Semiconductors
Datasheet
Philips Semiconductors
MECHANICAL DATA
1 Epoxy meets UL94 V0 at 1/8". Net mass: 1.4 g
May 2001
Logic level TOPFET
For soldering guidelines and SMD footprint design, please refer to Data Handbook SC18.
Plastic single-ended surface mounted package (Philips version of D
(one lead cropped)
DIMENSIONS (mm are the original dimensions)
UNIT
mm
Fig.2. SOT404 surface mounting package
VERSION
OUTLINE
SOT404
4.50
4.10
A
H D
1.40
1.27
A 1
D
D 1
0.85
0.60
b
IEC
0.64
0.46
c
max.
1
11
D
e
JEDEC
E
1.60
1.20
D 1
2
e
REFERENCES
10.30
9.70
E
3
0
b
2.54
e
scale
EIAJ
2.5
5
1
, centre pin connected to mounting base.
2.90
2.10
L p
5 mm
15.40
14.80
H D
mounting
2.60
2.20
2
Q
base
-PAK); 3 leads
L p
A 1
Q
PROJECTION
c
EUROPEAN
A
ISSUE DATE
98-12-14
99-06-25
Product specification
SOT404
PIP3115-B
Rev 1.000

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