pip3117-b NXP Semiconductors, pip3117-b Datasheet
pip3117-b
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pip3117-b Summary of contents
Page 1
... Continuous junction temperature j R Drain-source on-state resistance DS(ON) I Input supply current ISL FUNCTIONAL BLOCK DIAGRAM INPUT LOGIC AND PROTECTION Fig.1. Elements of the TOPFET. PIN CONFIGURATION Product specification PIP3117-B MAX. UNIT 150 ˚ 650 A IS DRAIN ...
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... ˚ ˚ 250 Hz mb REQUIRED CONDITION 5 CONDITIONS - minimum footprint FR4 PCB the over temperature trip operates to protect the switch. j(TO) 2 Product specification PIP3117-B MIN. MAX. UNIT - self - A limited - - -55 175 ˚ ...
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... V;T = 25˚ device trips if P > D(TO) 1 which determines trip time according to the formula ln DSC . IS 3 Product specification PIP3117-B MIN. TYP. MAX 100 = 25 ˚ ˚ 100 = 25 ˚ MIN ...
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... < IS1 IS2 Refer to waveform figure and test circuit. L CONDITIONS Product specification PIP3117-B MIN. TYP. MAX. 0 25˚C 1.1 1.6 2 100 220 400 195 330 IS ...
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... For soldering guidelines and SMD footprint design, please refer to Data Handbook SC18. May 2001 E mounting 2 scale max. 1.60 10.30 2.90 15.40 11 2.54 1.20 9.70 2.10 14.80 REFERENCES JEDEC EIAJ 1 , centre pin connected to mounting base. 5 Product specification PIP3117-B 2 -PAK); 3 leads SOT404 base 2.60 2.20 EUROPEAN ISSUE DATE PROJECTION 98-12-14 99-06-25 Rev 1.000 ...
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... This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A 6 Product specification PIP3117-B Rev 1.000 ...