pip3119-p NXP Semiconductors, pip3119-p Datasheet - Page 5

• Manufacturer Part Number: pip3119-p
• Description: Logic Level Topfet
• Manufacturer: NXP Semiconductors

Philips Semiconductors
MECHANICAL DATA
1 Refer to mounting instructions for SOT78 (TO220) envelopes. Epoxy meets UL94 V0 at 1/8". Net mass: 2 g
May 2001
Logic level TOPFET
Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-leads
DIMENSIONS (mm are the original dimensions)
Notes
1. The positional accuracy of the terminals is controlled within zone L 1 max.
2. Mounting base configuration is not defined within the dimensions E and D
UNIT
mm
OUTLINE
VERSION
SOT78B
4.5
4.1
A
Fig.2. SOT78B (TO220AB) package
1.39
1.27
A 1
0.85
0.60
b
(1)
IEC
D
L
1.3
1.0
b 1
D 1
L 1
b 1
0.7
0.4
c
JEDEC
15.8
15.2
1
e
D
p 1
E
p
b
REFERENCES
2
(1)
e
6.4
5.9
D 1
0
3
10.3
9.7
E
w
L 2
q
scale
EIAJ
M
5
5
1
, pin 2 connected to mounting base.
2.54
e
10 mm
15.0
13.5
L
mounting
base
(2)
3.30
2.79
L 1
max.
Q
3.0
L 2
A
A 1
PROJECTION
3.8
3.6
c
EUROPEAN
p
4.3
4.1
p 1
3.0
2.7
q
ISSUE DATE
01-02-22
2.6
2.2
Product specification
Q
SOT78B
0.4
PIP3119-P
w
Rev 1.000