tb6539fg TOSHIBA Semiconductor CORPORATION, tb6539fg Datasheet - Page 19
![no-image](/images/manufacturer_photos/0/6/670/toshiba_semiconductor_corporation_sml.jpg)
tb6539fg
Manufacturer Part Number
tb6539fg
Description
3-phase Full-wave Sine-wave Pwm Brushless Motor Control
Manufacturer
TOSHIBA Semiconductor CORPORATION
Datasheet
1.TB6539FG.pdf
(20 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TB6539FG
Manufacturer:
TOSHIBA/东芝
Quantity:
20 000
Notes on Contents
1. Block Diagrams
2. Equivalent Circuits
3. Timing Charts
4. Application Circuits
5. Test Circuits
IC Usage Considerations
[1]
[2] Do not insert devices in the wrong orientation or incorrectly.
Points to remember on handling of ICs
(1) Heat Radiation Design
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified
for explanatory purposes.
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for
explanatory purposes.
Timing charts may be simplified for explanatory purposes.
The application circuits shown in this document are provided for reference purposes only. Thorough
evaluation is required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of
application circuits.
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.
Notes on handling of ICs
The
exceeded, even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and
exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation
or incorrectly even just one time.
In using an IC with large current flow such as power amp, regulator or driver, please design the
device so that heat is appropriately radiated, not to exceed the specified junction temperature (T
at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat
radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown.
In addition, please design the device taking into considerate the effect of IC heat radiation with
peripheral components.
absolute maximum ratings of a semiconductor device are a set of ratings that must not be
19
TB6539N/NG/F/FG
2007-07-17
J
)