tda3673at-n1 NXP Semiconductors, tda3673at-n1 Datasheet
tda3673at-n1
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tda3673at-n1 Summary of contents
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TDA3673 Very low dropout voltage/quiescent current 3.3 V voltage regulator with enable Rev. 05 — 10 June 2005 1. General description The TDA3673 is a fixed 3.3 V voltage regulator with very low dropout voltage and quiescent current, which operates ...
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... Philips Semiconductors 4. Ordering information Table 2: Type number Package TDA3673AT 5. Block diagram Fig 1. Block diagram 9397 750 15051 Product data sheet Very low dropout voltage/quiescent current 3.3 V voltage regulator Ordering information Name Description SO8 plastic small outline package; 8 leads; body width 3 ...
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Philips Semiconductors 6. Pinning information 6.1 Pinning Fig 2. Pin configuration 6.2 Pin description Table 3: Symbol REG GND n. [1] All GND pins are connected to the lead frame and can also be used to reduce ...
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Philips Semiconductors 8. Limiting values Table 4: In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter P(rp) P tot T stg T amb Thermal characteristics Table 5: Symbol Parameter R th(j-a) ...
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Philips Semiconductors Table 6: Characteristics …continued measured in test circuit of P amb Symbol Parameter V line input regulation REG(line) voltage V load output regulation REG(load) voltage SVRR supply voltage ripple rejection ...
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Philips Semiconductors 11.3 Application circuits The maximum output current of the regulator equals: I REG max When T For successful operation of the IC (maximum output current capability) special attention has to be given to the copper area required as ...
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Philips Semiconductors 11.4 Additional application information This section gives typical curves for various parameters measured on the TDA3673. Standard test conditions are REG ...
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Philips Semiconductors 2 I (1) q (mA) 1.5 1 0 load q ( load q Fig 8. Quiescent current as a function of the junction temperature. ...
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Philips Semiconductors 4 V REG ( 100 pulsed load. P Fig 12. Foldback protection mode 12. Test information 12.1 Quality information The General Quality Specification for Integrated Circuits, SNW-FQ-611 is applicable. ...
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Philips Semiconductors 13. Package outline SO8: plastic small outline package; 8 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...
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Philips Semiconductors 14. Soldering 14.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages ...
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Philips Semiconductors – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, ...
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Philips Semiconductors [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, ...
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Philips Semiconductors 15. Revision history Table 10: Revision history Document ID Release date TDA3673_5 20050610 • Modifications: The format of this data sheet has been redesigned to comply with the new presentation and information standard of Philips Semiconductors. • Section ...
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Philips Semiconductors 16. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...
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Philips Semiconductors 21. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...