tps856 TOSHIBA Semiconductor CORPORATION, tps856 Datasheet - Page 6

• Manufacturer Part Number: tps856
• Description: Toshiba Photo-ic Silicon Epitaxial Planar
• Manufacturer: TOSHIBA Semiconductor CORPORATION

Packing Specification
(3)
(1)
(2)
(2) Recommended soldering pattern
•
•
•
Cleaning conditions
Packing quantity
Packing format
•
When cleaning is required after soldering
Silica gel and reel are packed into sealed aluminum envelope.
Pack shock-absorbent materials around the aluminum envelopes in the cartons to cushion them.
Second reflow soldering
In case of second reflow soldering, it should be performed within 168 h after first reflow under the
above conditions.
Storage conditions before second reflow soldering: 30°C, 70% RH or lower
Do not perform flow soldering.
Make any necessary soldering correction manually.
(Do not do this more than once for any given pin.)
Carton specification
Chemicals: AK225 alcohol
Temperature and time: 50°C × 30 s or 30°C × 3 min
Ultrasonic cleaning: 300 W or less
Carton dimensions
Reel (minimum packing quantity)
Temperature: no more than 350°C (25 W for soldering iron)
Time: within 5 s
(W) 81 mm × (L) 280 mm × (H) 280 mm
Carton
0.5
1.0
0.5
6
0.3
5 reels (15,000 devices)
Label
3,000 devices
Unit: mm
2007-10-01
TPS856