MC100EP35DT ON Semiconductor, MC100EP35DT Datasheet - Page 10

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MC100EP35DT

Manufacturer Part Number
MC100EP35DT
Description
IC FLIP FLOP JK ECL HS LV 8TSSOP
Manufacturer
ON Semiconductor
Series
100EPr
Type
JK Typer
Datasheet

Specifications of MC100EP35DT

Function
Reset
Output Type
Differential
Number Of Elements
1
Number Of Bits Per Element
1
Frequency - Clock
3GHz
Delay Time - Propagation
410ps
Trigger Type
Positive Edge
Voltage - Supply
3 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
8-TSSOP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Current - Output High, Low
-
Other names
MC100EP35DTOS

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC100EP35DTG
Manufacturer:
ON Semiconductor
Quantity:
4
0.15 (0.006) T
0.15 (0.006) T
−T−
0.10 (0.004)
SEATING
PLANE
L
U
U
S
S
PIN 1
IDENT
D
2X
L/2
C
8
1
−V−
A
8x
4
5
K
G
0.10 (0.004)
REF
−U−
B
PLASTIC TSSOP PACKAGE
PACKAGE DIMENSIONS
M
http://onsemi.com
T
CASE 948R−02
DT SUFFIX
U
TSSOP−8
DETAIL E
ISSUE A
S
10
DETAIL E
V
S
F
0.25 (0.010)
M
−W−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
5. TERMINAL NUMBERS ARE SHOWN FOR
6. DIMENSION A AND B ARE TO BE DETERMINED
Y14.5M, 1982.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
REFERENCE ONLY.
AT DATUM PLANE -W-.
DIM
M
A
B
C
D
F
G
K
L
MILLIMETERS
MIN
2.90
2.90
0.80
0.05
0.40
0.25
0
0.65 BSC
4.90 BSC
_
MAX
3.10
3.10
1.10
0.15
0.70
0.40
6
_
0.031
0.002
0.016
0.010
0.114
0.114
MIN
0.026 BSC
0.193 BSC
0
INCHES
_
0.122
0.122
0.043
0.006
0.028
0.016
MAX
6
_

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