pip250m NXP Semiconductors, pip250m Datasheet - Page 16

• Manufacturer Part Number: pip250m
• Description: Pip250m Integrated Buck Converter
• Manufacturer: NXP Semiconductors

Philips Semiconductors
9397 750 10904
Product data
Fig 15. PCB footprint for SOT687-1 package (reflow soldering).
11.15 OA
(2 )
7.6 Cu
(2 )
4.1
0.4 SP (2 )
15.2 Solder paste printing
0.6 Cu
e = 0.5
1 SP
(8 )
The process of printing the solder paste requires care because of the fine pitch and
small size of the solder lands. A stencil thickness of 0.125 mm is recommended. The
stencil apertures can be made the same size as the PCB lands in
The type of solder paste recommended for HVQFN packages is “No clean”, Type 3,
due to the difficulty of cleaning flux residues from beneath the package.
1 SP
(8 )
Rev. 02 — 21 February 2003
0.4 SP
8.63 OA
0.6 Cu
(4 )
4.1
0.4 SP
(10 )
1 SP
MGW820
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
0.28 Cu (68 )
Integrated buck converter
0.5 SP
(4 )
0.9 SP
solder lands
Cu pattern
clearance
solder paste
occupied area
Figure
PIP250M
(10 )
8.9 Cu
(2 )
15.
10.8 Cu
(2 )
16 of 19
0.1
0.2
0.025