hcs245ms Intersil Corporation, hcs245ms Datasheet

hcs245ms

Manufacturer Part Number

hcs245ms

Description

Radiation Hardened Octal Bus Transceiver, Three-state, Non-inverting

Manufacturer

Intersil Corporation

Datasheet

1.HCS245MS.pdf (7 pages)

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December 1992

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.

Features

• 3 Micron Radiation Hardened CMOS SOS

• Total Dose 200K or 1 Mega-RAD(Si)

• Latch-Up Free Under Any Conditions

• Fanout (Over Temperature Range)

• Military Temperature Range: -55

• Signiﬁcant Power Reduction Compared to LSTTL ICs

• DC Operating Voltage Range: 4.5V to 5.5V

• LSTTL Input Compatibility

• Input Current Levels Ii

Description

The Intersil HCS245MS is a Radiation Hardened Non-Invert-

ing Octal Bidirectional Bus Transceiver, Three-State,

intended for two-way asynchronous communication between

data busses. The HCS245MS allows data transmission from

the A bus to the B bus or from the B bus to the A bus. The

logic level at the direction input (DIR) determines the data

direction. The output enable input (OE) puts the I/O port in

the high-impedance state when high.

The HCS245MS utilizes advanced CMOS/SOS technology

to achieve high-speed operation. This device is a member of

radiation hardened, high-speed, CMOS/SOS Logic Family.

The HCS245MS is supplied in a 20 lead Weld Seal Ceramic

ﬂatpack (K sufﬁx) or a Weld Seal Ceramic Dual-In-Line

Package (D sufﬁx).

Truth Table

H = High Voltage Level, L = Low Voltage Level,

X = Immaterial

To prevent excess currents in the High-Z (Isolation)

modes, all I/O terminals should be terminated with 10k

to 1M resistors.

- Bus Driver Outputs - 15 LSTTL Loads

- VIL = 0.8V Max

- VIH = VCC/2 Min

CONTROL

INPUTS

DIR

5 A at VOL, VOH

B Data to A Bus

A Data to B Bus

Isolation

OPERATION

C to +125

Octal Bus Transceiver, Three-State, Non-Inverting

Functional Diagram

OUTPUT

ENABLE

B DATA

(18, 17, 16, 15,

14, 13, 12)

7-475

DIR

Pinouts

MIL-STD-1835 DESIGNATOR CDFP4-F20, LEAD FINISH C

GND

MIL-STD-1835 DESIGNATOR CDIP2-T20, LEAD FINISH C

DIR

HCS245MS

ONE OF 8 TRANSCEIVERS

20 PIN CERAMIC DUAL-IN-LINE

GND

20 PIN CERAMIC FLAT PACK

DIR

TOP VIEW

Radiation Hardened

File Number

VCC

TO OTHER

7 BUFFERS

(2, 3, 4, 5,

6, 7, 8)

A DATA

VCC

2468.1

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hcs245ms Summary of contents

Page 1

... The HCS245MS utilizes advanced CMOS/SOS technology to achieve high-speed operation. This device is a member of radiation hardened, high-speed, CMOS/SOS Logic Family. The HCS245MS is supplied lead Weld Seal Ceramic ﬂatpack (K sufﬁ Weld Seal Ceramic Dual-In-Line Package (D sufﬁx). Truth Table ...

Page 2

... VIH = 0.70(VCC), VIL = 0.30(VCC) (Note 2) NOTE: 1. All voltages reference to device GND. 2. For functional tests, VO 4.0V is recognized as a logic “1”, and VO Speciﬁcations HCS245MS Reliability Information Thermal Impedance . . . . . . . . . . . . . . . . Weld Seal DIC . . . . . . . . . . . . . . . . . . . 10mA Weld Seal Flat Pack . . . . . . . . . . . . . . ...

Page 3

... VIH = 0.70(VCC), VIL = 0.30(VCC) at 200K RAD, VIL = 0.12(VCC RAD, IOH = -50 A Input Leakage Current IIN VCC = 5.5V, VIN = VCC or GND Three-State Output IOZ Applied Voltage = 0V or VCC Leakage Current Speciﬁcations HCS245MS GROUP (NOTES SUB- CONDITIONS GROUPS TEMPERATURE 9 10 10, 11 ...

Page 4

... Group A (Note 1) Group B Subgroup B-5 Subgroup B-6 Group D NOTE: 1. Alternate Group A testing in accordance with Method 5005 of MIL-STD-883 may be exercised. CONFORMANCE GROUPS METHOD Group E Subgroup 2 5005 NOTE: 1. Except FN test which will be performed 100% Go/No-Go. Speciﬁcations HCS245MS (NOTES 1, 2) TEMP- CONDITIONS ERATURE +25 C ...

Page 5

... VOH 80% 20% OUTPUT VOL AC VOLTAGE LEVELS PARAMETER HCS VCC 4.50 VIH 4.50 VS 2.25 VIL 0 GND 0 Speciﬁcations HCS245MS 1/2 VCC = 3V 0.5V VCC = 6V 0. for static burn-in. 5% for dynamic burn-in. TABLE 9. IRRADIATION TEST CONNECTIONS GROUND 10 5% for irradiation testing. Group E, Sub- AC Load Circuit ...

Page 6

... However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site http://www.intersil.com HCS245MS Three-State Low Load Circuit TPLZ ...

Page 7

... Material: Silver Epoxy WORST CASE CURRENT DENSITY <2 A/cm BOND PAD SIZE: 100 m x 100 m 4 mils x 4 mils Metallization Mask Layout NC A0 (2) A1 (3) A2 (4) A3 (5) A4 (6) A5 (7) (8) A6 HCS245MS HCS245MS DIR VCC (1) (20 (9) (10) (11) (12) A7 GND B7 B6 7-481 OE (19) (18) B0 ...

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