lpc2926 NXP Semiconductors, lpc2926 Datasheet - Page 76

• Manufacturer Part Number: lpc2926
• Description: Lpc2926/2927/2929 Arm9 Microcontroller With Can, Lin, And Usb
• Manufacturer: NXP Semiconductors

NXP Semiconductors
Table 39.
V
T
specified.
[1]
LPC2926_27_29
Product data sheet
Symbol
f
t
SPI
su(SPI_MISO)
vj
DD(CORE)
=
All parameters are guaranteed over the virtual junction temperature range by design. Pre-testing is performed at T
temperature on wafer level. Cased products are tested at T
test conditions to cover the specified temperature and power supply voltage range.
−
40
°
[1]
C to +85
= V
Dynamic characteristics of SPI pins
DD(OSC_PLL)
Parameter
SPI operating frequency
SPI_MISO set-up time
9.4 Dynamic characteristics: SPI
°
C; all voltages are measured with respect to ground; positive currents flow into the IC; unless otherwise
; V
Fig 27. SPI data input set-up time in SSP Master mode
DD(IO)
SDOn
SCKn
shifting edges
SDIn
= 2.7 V to 3.6 V; V
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 28 September 2010
Conditions
master operation
slave operation
T
measured in
SPI Master
mode; see
Figure 27
amb
DDA(ADC3V3)
= 25 °C;
amb
= 25 °C (final testing). Both pre-testing and final testing use correlated
= 3.0 V to 3.6 V; V
t
su(SPI_MISO)
ARM9 microcontroller with CAN, LIN, and USB
Min
1
1
-
LPC2926/2927/2929
⁄
⁄
65024
65024
DDA(ADC5V0)
f
f
clk(SPI)
clk(SPI)
Typ
-
-
11
= 3.0 V to 5.5 V;
sampling edges
Max
1
1
-
© NXP B.V. 2010. All rights reserved.
⁄
⁄
2
4
amb
f
f
clk(SPI)
clk(SPI)
= 85 °C ambient
002aae695
Unit
MHz
MHz
ns
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