acpl-w611 Avago Technologies, acpl-w611 Datasheet - Page 4

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acpl-w611

Manufacturer Part Number
acpl-w611
Description
High Cmr, High Speed Ttl Compatible Optocoupler
Manufacturer
Avago Technologies
Datasheet
Recommended Solder Reflow Thermal Profile
TEMPERATURE
Note: Use of non chlorine-activated fluxes is highly recommended.
Recommended Pb-Free IR Profile
Note: Use of non chlorine-activated fluxes is highly recommended.
4
ROOM
T
T
smax
smin
25
T
T
p
L
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
smax
217 °C
150 - 200 °C
300
200
100
= 200 °C, T
0
0
t 25 °C to PEAK
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
60 to 180 SEC.
3 °C/SEC. MAX.
160°C
150°C
140°C
PREHEAT
smin
t
RAMP-UP
s
= 150 °C
260 +0/-5 °C
TIME
50
3°C + 1°C/–0.5°C
150°C, 90 + 30 SEC.
PREHEATING TIME
t
t
L
p
2.5°C ± 0.5°C/SEC.
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
100
RAMP-DOWN
6 °C/SEC. MAX.
TIME (SECONDS)
TEMP.
PEAK
245°C
150
SEC.
30
SEC.
30
Regulatory Information
The ACPL-W611 and ACPL-P611 is approved/pending ap-
proval by the following organizations:
IEC/EN/DIN EN 60747-5-2 (Option 060 only)
Approval under:
IEC 60747-5-2 :1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01
UL
Approval under UL 1577, component recognition
program up to V
CSA
Approval under CSA Component Acceptance Notice #5,
File CA 88324.
50 SEC.
SOLDERING
200°C
TIME
200
PEAK
TEMP.
240°C
TIGHT
TYPICAL
LOOSE
ISO
TEMP.
230°C
PEAK
= 5000 V
250
RMS
. File E55361.

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