lmv242mwa National Semiconductor Corporation, lmv242mwa Datasheet - Page 15

• Manufacturer Part Number: lmv242mwa
• Description: Dual Output, Quad-band Gsm/gprs Power Amplifier Controller
• Manufacturer: National Semiconductor Corporation

Die / Wafer Characteristics
Physical Die Identification
Die Step
Wafer Diameter
Die Size (Drawn)
Thickness
Min Pitch
Fabrication Attributes
Physical Attributes
200 mm
889 µm x 1562 µm
35.0 mils x 61.5 mils
216 µm Nominal
123 µm Nominal
LMV242A
A
10-Pad Bare Die
15
Note: Note: Actual die size is rounded to the nearest micron
Bond Pad Opening Size (min)
Bond Pad Metallization
Passivation
Back Side Metal
Back Side Connection
20079503
General Die Information
92 µm x 92µm
0.5% Copper_Bal.
Aluminum
VOM Nitride
Bare Back
Floating
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