2n7002sspt Chenmko Enterprise Co. Ltd., 2n7002sspt Datasheet - Page 5

• Manufacturer Part Number: 2n7002sspt
• Description: Surface Mount Dual N-channel Enhancement Mos Fet
• Manufacturer: Chenmko Enterprise Co. Ltd.

Typical Thermal Characteristics
Figure 12. SOT-6 Dual Package Maximum
0.05
0.02
0.01
0.5
0.2
0.1
1.2
1.1
0.9
0.8
0.7
0.6
Figure 14. Maximum Safe Operating Area.
3
2
1
1
1
Steady-State Power Dissipation versus Copper
Mounting Pad Area.
0
1c
0.05
0.02
0.01
1 b
0 .5
0 .2
0 .1
0 .0 0 0 1
1
R
θ
SINGLE PULSE
1a
J A
T
V
2
= See Note 1c
A
GS
D = 0.5
0.2
2oz COPPER MOUNTING PAD AREA (in
0.2
= 25°C
0.1
= 10V
0.05
V
0.02
0.01
Single Pulse
DS
, DRAIN-SOURCE VOLTAGE (V)
RATING CHARACTERISTIC CURVES ( 2N7002SSPT )
5
Figure 15. Transient Thermal Response Curve
Note: Thermal characterization performed using the conditions described in note 1c. Transient thermal response will change
0 .001
0.4
depending on the circuit board design.
1 0
0.6
2 0
0 .0 1
4.5"x5" FR-4 Board
T
Still Air
A
= 2 5 C
2
0.8
)
o
5 0
7 0
1
0 .1
t , TIME (sec)
1
0.55
0.45
0.35
0.5
0.4
Figure 13. Maximum Steady-State Drain
0
1c
1 b
.
1
Current versus Copper Mounting Pad
Area.
0.025
2oz COPPER MOUNTING PAD AREA (in
P(pk)
0.05
1 0
T - T
Duty Cycle, D = t
R
J
R
θ JA
θ JA
t
1
A
(t) = r(t) * R
t
= P * R
2
= See Note 1c
0.075
θ
JA
1
4.5"x5" FR-4 Board
T
Still Air
V
/ t
θ JA
A
G S
(t)
1 0 0
2
= 2 5 C
= 1 0 V
2
0.1
o
)
3 0 0
NDC7002N.SAM
0.125
1a