74LX1G04CTR STMicroelectronics, 74LX1G04CTR Datasheet - Page 6

• Manufacturer Part Number: 74LX1G04CTR
• Description: IC INVERTER SGL CMOS LV SOT323-5
• Manufacturer: STMicroelectronics
• Series: 74LXr

Specifications of 74LX1G04CTR

• Logic Type: Inverter
• Number Of Inputs: 1
• Number Of Circuits: 1
• Current - Output High, Low: 32mA, 32mA
• Voltage - Supply: 1.65 V ~ 5.5 V
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: SC-70-5, SC-88A, SOT-323-5, SOT-353, 5-TSSOP
• Logic Family: 74LX
• High Level Output Current: - 32 mA
• Low Level Output Current: 32 mA
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1.65 V
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 55 C
• Mounting Style: SMD/SMT
• Operating Supply Voltage: 1.65 V to 5.5 V
• Logical Function: Inverter
• Number Of Elements: 1
• Propagation Delay Time: 11.5ns
• Operating Supply Voltage (typ): 1.8/2.5/3.3/5V
• Package Type: SOT-323
• Operating Temp Range: -55C to 125C
• Pin Count: 5
• Quiescent Current: 10uA
• Technology: CMOS
• Mounting: Surface Mount
• Operating Temperature Classification: Military
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 1.65V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-4027-2

74LX1G04
Figure 1 : RECOMMENDED SOLDERING REFLOW PROFILE FOR LEADFREE FLIP-CHIP
MOUNTING ON PCB
For Flip-Chip mounting on the PCB, STMicroelectronics recommends the use of a solder stencil aperture
of 330 x 330 µm² maximum and a typical stencil thickness of 125µm. Flip-Chips are fully compatible with
the use of near eutectic 95.5Sn 4Ag 0.5Cu solder paste with no clean flux. ST's recommendations for
Flip-Chip board mounting are illustrated on the soldering reflow profile shown in figure 1 below.
Dwell time in the soldering zone (with temperature higher than 220°C) has to be kept as short as possible
to prevent component and substrate damages. Peak temperature must not exceed 260°C. Controlled
atmosphere (N2 or N2H2) is recommended during the whole reflow, specially above 150°C.
Flip-Chips are able to withstand three times the previous recommended reflow profile in order to be
compatible with a double reflow when SMDs are mounted on both sides of the PCB plus one additional
repair. A maximum of three soldering reflows are allowed for these leadfree packages (with repair step
included). The use of a no clean flux is highly recommended to avoid any cleaning operation. In order to
prevent any bump cracks, ultrasonic cleaning methods are not recommended.
6/13
Temperature (˚C)
Temperature (˚C)
260˚C max
260˚C max
255˚C
255˚C
125 ˚C
125 ˚C
220˚C
220˚C
180˚C
180˚C
0
0
0
0
3˚C/s max
3˚C/s max
1
1
90 to 150 sec
2
2
3
3
4
4
90 sec max
90 sec max
10-30 sec
10-30 sec
5
5
2˚C/s recommended
6
6
6˚C/s max
2˚C/s recommended
6˚C/s max
Time (min)
Time (min)
7
7