LMV1032UP-25 National Semiconductor Corporation, LMV1032UP-25 Datasheet - Page 10

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LMV1032UP-25

Manufacturer Part Number
LMV1032UP-25
Description
Amplifiers For 3 Wire Analog Electret Microphones
Manufacturer
National Semiconductor Corporation
Datasheet
Physical Dimensions
inches (millimeters)
unless otherwise noted
NOTE: UNLESS OTHERWISE SPECIFIED.
1. TITANIUM COATING.
2. FOR SOLDER BUMP COMPOSITION, SEE "SOLDER INFORMATION" IN THE PACKAGING SECTION OF THE NATIONAL SEMICONDUCTOR WEB
PAGE (www.national.com).
3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD.
4. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION.
5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS
PACKAGE HEIGHT.
6. REFERENCE JEDEC REGISTRATION MO-211. VARIATION BC.
4-Bump Ultra Thin micro SMD
NS Package Number UPA04QQA
X1 = 1.133mm X2 = 1.133mm X3 = 0.4mm
www.national.com
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