mpxa6115ac6t1mpxa6115a Freescale Semiconductor, Inc, mpxa6115ac6t1mpxa6115a Datasheet - Page 6

• Manufacturer Part Number: mpxa6115ac6t1mpxa6115a
• Description: Mpxh6115a High Temperature Accuracy Integrated Pressure Sensor
• Manufacturer: Freescale Semiconductor, Inc

design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to a
MPXA6115A
6
Surface mount board layout is a critical portion of the total
MINIMUM RECOMMENDED FOOTPRINT FOR SMALL AND SUPER SMALL PACKAGES
0.060 TYP 8X
1.52
0.150
Figure 6. SSOP Footprint (Case 1317 and 1317A)
3.81
Figure 5. SOP Footprint (Case 482)
0.050
1.27
TYP
0.100 TYP 8X
2.54
0.660
16.76
0.053 TYP 8X
1.35
solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
0.387
0.027 TYP 8X
9.83
0.69
inch
mm
inch
mm
0.100 TYP
2.54
0.300
7.62
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Sensors