oq2538u NXP Semiconductors, oq2538u Datasheet
oq2538u
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oq2538u Summary of contents
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... DATA SHEET OQ2538HP; OQ2538U SDH/SONET STM16/OC48 main amplifiers Product specification Supersedes data of 1998 Oct 14 File under Integrated Circuits, IC19 INTEGRATED CIRCUITS 2000 Sep 29 ...
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... AGC and LOS input signal levels. An internal automatic offset compensation circuit eliminates offset in the amplifier chain. PACKAGE DESCRIPTION plastic low profile quad flat package; 48 leads; body 7 bare die; dimensions 2070 2070 2 Product specification OQ2538HP; OQ2538U 7 1.4 mm 380 m VERSION SOT313-2 ...
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... INQ 2000 Sep AMP A AMP B AMP C reference BAND GAP voltage for all cells REF CAPA COFF COFFQ Fig.1 Block diagram. 3 Product specification OQ2538HP; OQ2538U 3 AGC 43 A AGCDC 19 LOS 18 B LOSDC 32 OUT AMP D 30 OUTQ OQ2538HP MGE745 GND ...
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... O main amplifier inverted output 17 O main amplifier output 25 O rectifier A reference output 26 A pin for connecting automatic offset control capacitor (return pin for connecting automatic offset control capacitor 4 Product specification OQ2538HP; OQ2538U DESCRIPTION pad unconnected! EE ...
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... V EE n.c. AGC GND GND INQ GND IN GND GND n. 2000 Sep OQ2538HP Fig.2 Pin configuration. 5 Product specification OQ2538HP; OQ2538U n.c. 34 GND 33 GND 32 OUT 31 GND 30 OUTQ 29 GND 28 GND 27 n. MGE744 ...
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... The input circuit for pins IN and INQ contains internal 100 resistors decoupled to ground via an internal common mode 6 pF capacitor. The topology is depicted in Fig.3. handbook, halfpage (1) C ext 6 Product specification OQ2538HP; OQ2538U = 50 must be used for the o(odd) GND 6 pF 100 100 IN INQ MGM114 Fig ...
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... The output circuit of the OQ2538HP is depicted in Fig.6. For more information see “Application Note AN96051” describing the OM5801 STM16 demo board. INQ MGM115 handbook, halfpage 22 nF 100 IN INQ 100 22 nF MGM116 7 Product specification OQ2538HP; OQ2538U pull-up GND 100 100 OUT OUTQ MGM117 Fig.6 RF output topology. ...
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... PORT 2 OQ2538HP test PCB 100 pF IN OUT 100 pF INQ OUTQ 100 100 100 4.5 V Fig.7 S and group delay measurement set-up Product specification OQ2538HP; OQ2538U measurements make sure the input semi rigid 50 semi rigid 50 SMA 100 termination MGM111 ...
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... Vertical scale 6 dB/division. Linear frequency sweep; start: 30 kHz; stop: 6 GHz. (1) 41.603 dB; 1 GHz. (2) 38.633 dB; 3.45 GHz. (3) 41.291 dB; 2 GHz. (4) 41.386 dB; 2.5 GHz. Fig.8 S 2000 Sep 29 (2) (4) (3) characteristic, measured on the OQ2538HP test PCB Product specification OQ2538HP; OQ2538U MGM160 stop: 6 GHz ...
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... Vertical scale 200 ps/division. Linear frequency sweep; start: 30 kHz; stop: 6 GHz. (1) 832.91 ps; 1 GHz. (2) 1007.4 ps; 3.45 GHz. (3) 834 ps; 2 GHz. (4) 860.93 ps; 2.5 GHz. Fig.9 Group delay characteristic, measured on the OQ2538HP test PCB. 2000 Sep 29 (2) (4) (3) 10 Product specification OQ2538HP; OQ2538U MGM161 stop: 6 GHz ...
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... OQ2538HP test PCB 100 pF IN OUT 100 pF INQ OUTQ 100 100 4.5 V Fig.10 Noise figure measurement set-up. 11 Product specification OQ2538HP; OQ2538U can be replaced with the available noise 173 – matching resistors), this yields a SPECTRUM ANALYZER ...
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... To minimize low frequency switching noise in the vicinity of the OQ2538HP, the power supply line should be filtered once using an LC-circuit with a low cut-off frequency (see Fig.14). can be used as 12 Product specification OQ2538HP; OQ2538U V LOSDC (mV) 200 (2) (1) (3) 100 ...
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... The inputs IN and INQ and the outputs OUT and OUTQ have no protection against ESD. All other pins have a standard ESD protection structure, capable of withstanding 2 kV Human Body Model (HBM) zappings. pins). The RF signals EE 13 Product specification OQ2538HP; OQ2538U ...
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... Section “ESD protection”). THERMAL CHARACTERISTICS SYMBOL DESCRIPTION R thermal resistance from junction to solder point th(j-s) R thermal resistance from junction to ambient th(j-a) Note 1. R will be in the application from K/W, dependent on the PCB layout. th(j-a) 2000 Sep 29 OQ2538HP; OQ2538U CONDITIONS MIN. 6.0 note 1 600 2 0.1 65 CONDITIONS note 1 14 Product specifi ...
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... CONDITIONS note 1 note 2 note 4 note 4 note 5 note 6 note 7 note 8 note 9 note 10 note 10 open output note 12 note 13 open output note 12 note 13 open output referenced to V open output; note 14 15 Product specification OQ2538HP; OQ2538U MIN. TYP. 4.725 4.5 60 270 40 40 0.5 2.5 2.4 2.1 0.2 100 34 40 48.5 120 11 2.4 3.0 3.3 3 ...
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... open output note 16 input signal >2.5 mV (p-p) input signal >2.5 mV (p-p) see Fig.6 and are measured at 1 GHz (see Fig.7). Flatness deviations are within 3 dB load resistance and carry complementary signals. 16 Product specification OQ2538HP; OQ2538U MIN. TYP. MAX. UNIT 2 280 ...
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... OQ2538HP AGC 3 AGCDC 43 100 100 LOS LOSDC V EE 100 100 nF nF Fig.14 Typical application schematic. 17 Product specification OQ2538HP; OQ2538U OQ2541HP to data and clock recovery unit DATA AND CLOCK RECOVERY OUT 32 OUTQ 30 COFF 45 100 nF COFFQ 44 REF 21 CAPA ...
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... C INQ INQ OQ2538HP AGC 3 AGCDC 43 100 100 LOS LOSDC V EE 100 100 nF nF Fig. application schematic. 18 Product specification OQ2538HP; OQ2538U OUT 32 OUTQ 30 COFF 45 100 nF COFFQ 44 REF 21 CAPA GND V EE BAS85 10 H 5 MGM113 ...
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... Typical value. 2000 Sep OQ2538U (1) 2.07 mm Fig.16 Bonding pad locations of OQ2538U. 19 Product specification OQ2538HP; OQ2538U n.c. 19 GND 18 GND 17 OUT 16 GND 15 OUTQ 14 GND 13 GND ...
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... AGC +900 500 GND +900 300 GND +900 100 INQ +900 +100 GND +900 +300 IN +900 +500 GND 2 2.070 mm (4.285 Product specification OQ2538HP; OQ2538U COORDINATES PAD x 19 +900 20 +900 21 +700 22 +500 23 +300 24 +100 25 100 26 300 27 500 28 700 29 900 ...
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... 2.5 scale (1) ( 0.27 0.18 7.1 7.1 9.15 0.5 0.17 0.12 6.9 6.9 8.85 REFERENCES JEDEC EIAJ MS-026 21 OQ2538HP; OQ2538U detail 9.15 0.75 1.0 0.2 0.12 0.1 8.85 0.45 EUROPEAN PROJECTION Product specification SOT313 (1) ( 0.95 ...
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... If wave soldering is used the following conditions must be observed for optimal results: 2000 Sep 29 OQ2538HP; OQ2538U Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. For packages with leads on two sides and a pitch (e): – ...
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... Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 2000 Sep 29 OQ2538HP; OQ2538U SOLDERING METHOD WAVE not suitable ...
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... Product specification OQ2538HP; OQ2538U (1) These products are not Philips Semiconductors ...
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... Philips Semiconductors SDH/SONET STM16/OC48 main amplifiers 2000 Sep 29 OQ2538HP; OQ2538U NOTES 25 Product specification ...
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... Philips Semiconductors SDH/SONET STM16/OC48 main amplifiers 2000 Sep 29 OQ2538HP; OQ2538U NOTES 26 Product specification ...
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... Philips Semiconductors SDH/SONET STM16/OC48 main amplifiers 2000 Sep 29 OQ2538HP; OQ2538U NOTES 27 Product specification ...
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Philips Semiconductors – a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. + 101 ...