maapgm0005-die Tyco Electronics, maapgm0005-die Datasheet - Page 5

• Manufacturer Part Number: maapgm0005-die
• Description: Rf Amplifiers
• Manufacturer: Tyco Electronics

Specifications subject to change without notice.
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Email: [e-mail]
2mW Ku-Band Power Amplifier
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Europe: Tel. [phone], Fax[phone]
Asia/Pacific: Tel.[phone], Fax [phone]
Bond Pad Dimensions
DC Drain Supply Voltage VDD
1.992mm.
1.728mm.
1.162mm.
Mechanical Information
Chip Size: 2.492 x 1.992 x 0.075 mm
RF In and Out
Pad
0
0
GND:G
GND:G
G N D : G
G N D : G
GND:G
GND:G
Figure 5. Die Layout
GND:G
GND:G
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G N D : G
G N D : G
G N D : G
W = 8
S = 8
d = 25
i
G N D : G
G N D : G
G N D : G
G N D : G
G N D : G
G N D : G
GND:G
GND:G
G N D : G
GND:G
Size (µm)
100 x 200
200 x 150
G N D : G
G N D : G
G N D : G
G N D : G
G N D : G
G N D : G
(
G N D : G
G N D : G
98 x 78 x 3 mils)
G N D : G
G N D : G
G N D : G
G N D : G
G N D : G
G N D : G
MAAPGM0005-DIE
RO-P-DS-3035 - -
Size (mils)
4 x 8
8 x 6
1.153mm.
V 1.00