maapgm0005-die Tyco Electronics, maapgm0005-die Datasheet - Page 6

• Manufacturer Part Number: maapgm0005-die
• Description: Rf Amplifiers
• Manufacturer: Tyco Electronics

Specifications subject to change without notice.
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Email: [e-mail]
2mW Ku-Band Power Amplifier
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Europe: Tel. [phone], Fax[phone]
Asia/Pacific: Tel.[phone], Fax [phone]
Assembly Instructions:
Die attach: Use AuSn (80/20) 1-2 mil. preform solder. Limit time @ 300 °C to less than 5 minutes.
Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques. For
DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of
shortest length, although ball bonds are also acceptable.
Figure 6. Recommended operational configuration. Wire bond as shown.
RF
IN
G ND:G
GND:G
G N D : G
G N D : G
G ND:G
G ND:G
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GND:G
GND:G
G N D : G
G N D : G
G N D : G
W = 8
S = 8
d = 25
i
G N D : G
G N D : G
G N D : G
G N D : G
100 pF
G N D : G
G N D : G
GND:G
GND:G
G N D : G
G ND:G
G N D : G
G N D : G
G N D : G
G N D : G
G N D : G
G N D : G
G N D : G
G N D : G
G N D : G
G N D : G
0.1 µF
G N D : G
G N D : G
G N D : G
G N D : G
V
MAAPGM0005-DIE
DD
RO-P-DS-3035 - -
RF
OUT
V 1.00