am42dl1614 Meet Spansion Inc., am42dl1614 Datasheet - Page 23

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am42dl1614

Manufacturer Part Number
am42dl1614
Description
Stacked Multi-chip Package Mcp Flash Memory And Sram
Manufacturer
Meet Spansion Inc.
Datasheet
22
(Word Mode)
(Word Mode)
Addresses
Addresses
1Bh
1Ch
1Dh
1Eh
2Ah
2Bh
2Ch
2Dh
2Eh
3Ah
3Bh
3Ch
1Fh
20h
21h
22h
23h
24h
25h
26h
27h
28h
29h
2Fh
30h
31h
32h
33h
34h
35h
36h
37h
38h
39h
0027h
0036h
0000h
0000h
0004h
0000h
000Ah
0000h
0005h
0000h
0004h
0000h
0016h
0002h
0000h
0000h
0000h
0002h
0007h
0000h
0020h
0000h
003Eh
0000h
0000h
0001h
0000h
0000h
0000h
0000h
0000h
0000h
0000h
0000h
Data
Data
Table 12. Device Geometry Definition
V
D7–D4: volt, D3–D0: 100 millivolt
V
D7–D4: volt, D3–D0: 100 millivolt
V
V
Typical timeout per single byte/word write 2
Typical timeout for Min. size buffer write 2
Typical timeout per individual block erase 2
Typical timeout for full chip erase 2
Max. timeout for byte/word write 2
Max. timeout for buffer write 2
Max. timeout per individual block erase 2
Max. timeout for full chip erase 2
Device Size = 2
Flash Device Interface description (refer to CFI publication 100)
Max. number of byte in multi-byte write = 2
(00h = not supported)
Number of Erase Block Regions within device
Erase Block Region 1 Information
(refer to the CFI specification or CFI publication 100)
Erase Block Region 2 Information
Erase Block Region 3 Information
Erase Block Region 4 Information
Table 11. System Interface String
CC
CC
PP
PP
Min. voltage (00h = no V
Max. voltage (00h = no V
Min. (write/erase)
Max. (write/erase)
P R E L I M I N A R Y
Am42DL16x4D
N
byte
PP
PP
N
pin present)
times typical
pin present)
N
N
times typical (00h = not supported)
N
times typical
Description
Description
ms (00h = not supported)
N
N
N
times typical
N
N
µ
s (00h = not supported)
ms
µs
January 9, 2002

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