am49bds640ah Meet Spansion Inc., am49bds640ah Datasheet - Page 83
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am49bds640ah
Manufacturer Part Number
am49bds640ah
Description
Stacked Multichip Package Mcp , Flash Memory And Psram Cmos 1.8 Volt-only Simultaneous Read/write, Burst Mode 64 Megabit 4m ? 16-bit Flash Memory, And 16 Mbit 1m ? 16-bit Psram
Manufacturer
Meet Spansion Inc.
Datasheet
1.AM49BDS640AH.pdf
(84 pages)
- Current page: 83 of 84
- Download datasheet (2Mb)
PHYSICAL DIMENSIONS
TLB089—89-ball Fine-Pitch Ball Grid Array (FBGA) 10 x 8 mm Package
December 5, 2003
PACKAGE
JEDEC
SYMBOL
SD / SE
A
MD
ME
D1
eD
A1
A2
E1
φb
eE
D
A
E
n
CORNER
0.15
(2X)
PIN A1
A2
A1
C
B10,C1,C10,D1,D10,G1,G10
MIN
0.20
0.81
0.33
---
89X
10.00 mm x 8.00 mm
H1,H10,J1,J10
0.15
0.08
10.00 BSC.
INDEX MARK
PACKAGE
8.00 BSC.
7.20 BSC.
7.20 BSC.
0.80 BSC
0.80 BSC
0.40 BSC
6
TLB089
b
NOM
N/A
10
10
89
M
M
---
---
---
---
10
C
C
A B
MAX
1.20
0.97
0.43
---
SIDE VIEW
TOP VIEW
D
A D V A N C E
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
NOTE
Am49BDS640AH
C
0.15
A
(2X)
E
B
I N F O R M A T I O N
C
0.20 C
0.08
eE
C
10
NOTES:
1.
2.
3.
4.
5.
6
7
8.
9.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
eD
9
8
7
6
5
4
3
2
1
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
N/A
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
K
J
SD
H
7
BOTTOM VIEW
G
F
D1
E
D C
B
A
SE
CORNER
PIN A1
3294\ 16-038.22a
7
E1
81
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