hys64d32020hdl-5-c Infineon Technologies Corporation, hys64d32020hdl-5-c Datasheet
hys64d32020hdl-5-c
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HYS64D32020[H/G]DL–5–C HYS64D[32020/16000][H/G]DL–6– ...
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Edition 2004-03 Published by Infineon Technologies AG, St.-Martin-Strasse 53, 81669 München, Germany Infineon Technologies AG 2004. © All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as a guarantee of ...
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HYS64D32020[H/G]DL–5–C HYS64D[32020/16000][H/G]DL–6– ...
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HYS64D32020[H/G]DL–5–C,HYS64D[32020/16000][H/G]DL–6–C Revision History: Rev. 1.0 Previous Version: Rev. 0.5 Page Subjects (major changes since last revision) 6,7 Added DDR400 18 Updated I Currents and added DDR400 dd 24 Updated SPD Code Bytes 99 - 127 to FF and added SPD ...
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... Table of Contents 1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 4.1 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 4.2 Current Specification and Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4.3 AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 5 SPD Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 6 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Data Sheet HYS64D[32020/16000][H/G]DL–[5/6]–C Small Outline DDR SDRAM Modules 5 Rev. 1.0, 2004-03 ...
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... Description The HYS64D32020[H/G]DL–5–C and HYS64D[32020/16000][H/G]DL–6–C are industry standard 200-Pin Small Outline Dual-In-Line Memory Modules (SO-DIMMs) organized as 32M 64 and 16M 64. The memory array is designed with Double Data Rate Synchronous DRAMs (DDR SDRAM). A variety of decoupling capacitors are mounted on the PC board. The DIMMs feature serial presence detect based on a serial E ...
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... PC3200S–3033–1–A1 PC2700 (CL=2.5) HYS64D16000HDL–6–C PC2700S–2533–0–C1 HYS64D32020HDL–6–C PC2700S–2533–0–A1 Notes 1. All part numbers end with a place code designating the silicon-die revision. Reference information available on request. Example: HYS64D32020GDL-6-B, indicating rev. B dies are used for SDRAM components. ...
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... WE I SSTL Write Enable Address Signals 117 BA0 I SSTL Bank Address Bus 1:0 116 BA1 I SSTL Data Sheet HYS64D[32020/16000][H/G]DL–[5/6]–C Small Outline DDR SDRAM Modules Table 3 Pin Configuration of SO-DIMM (cont’d) Table 3 Pin# Name and Table 5 112 A0 111 A1 110 A2 109 A3 108 ...
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... DQ50 I/O SSTL 175 DQ51 I/O SSTL 164 DQ52 I/O SSTL 166 DQ53 I/O SSTL Data Sheet HYS64D[32020/16000][H/G]DL–[5/6]–C Small Outline DDR SDRAM Modules Table 3 Pin Configuration of SO-DIMM (cont’d) Pin# Name Pin Buffer Function Type Type 172 DQ54 I/O SSTL Data Bus 63:0 176 DQ55 ...
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... Serial Bus Data 194 SA0 I CMOS Slave Address Select Bus 2:0 196 SA1 I CMOS 198 SA2 I CMOS Data Sheet HYS64D[32020/16000][H/G]DL–[5/6]–C Small Outline DDR SDRAM Modules Table 3 Pin Configuration of SO-DIMM (cont’d) Pin# Name Power Supplies 1,2 V REF module 197 V DDSPD module 9,10, V ...
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... Other Pins 199 DDID DD Note: Pin in tristate, Data Sheet HYS64D[32020/16000][H/G]DL–[5/6]–C Small Outline DDR SDRAM Modules Table 3 Pin Configuration of SO-DIMM (cont’d) Pin# Name 85, NC 86, 97, 98, 124, 200 Table 4 Abbreviations for Pin Type Abbreviation Description ...
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... Figure 1 Pin Configuration Diagram 200-Pin SO-DIMM Table 6 Density Organization Memory Ranks 128MB 16M 64 1 256MB 32M 64 2 Data Sheet HYS64D[32020/16000][H/G]DL–[5/6]–C Small Outline DDR SDRAM Modules SDRAMs # row/bank/ SDRAMs columns bits 16M 16 4 13/2/9 16M 16 8 13/2/9 12 Pin Configuration Refresh Period ...
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... Notes therefore V strap open DD DDQ DDID 2. DQ, DQS, DM resistors are BAn, An, RAS, CAS, WE resistors are 7.5 Data Sheet HYS64D[32020/16000][H/G]DL–[5/6]–C Small Outline DDR SDRAM Modules Table 7 Clock Signal Loads Clock Input CK0, CK0 CK1, CK1 ...
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... Block Diagram Raw Card A 64 2 Ranks 8 Notes therefore V strap open DD DDQ DDID 2. DQ, DQS, DM resistors are 18 ohms +/-5% Data Sheet HYS64D[32020/16000][H/G]DL–[5/6]–C Small Outline DDR SDRAM Modules BAn, An, RAS, CAS, WE resistors are 22 ohms +/- 5% 14 Pin Configuration Rev ...
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... V IL(DC) Input Voltage Level, V IN(DC) CK and CK Inputs Input Differential Voltage, V ID(DC) CK and CK Inputs VI-Matching Pull-up VI Ratio Current to Pull-down Current Data Sheet HYS64D[32020/16000][H/G]DL–[5/6]–C Small Outline DDR SDRAM Modules Symbol Values min. typ. max –0.5 – OUT V –1 – +3 –1 – ...
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... V. For a given output, it represents the maximum difference between pull-up and pull-down drivers due to process variation. 7) Inputs are not recognized as valid until 8) Values are shown per DDR SDRAM component Data Sheet HYS64D[32020/16000][H/G]DL–[5/6]–C Small Outline DDR SDRAM Modules Values Min. Typ. Max. –2 2 – ...
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... for DDR266(A for DDR333 and DDR400B Auto-Refresh Current burst refresh RC RFCMIN Self-Refresh Current CKE 0.2 V; external clock on Operating Current 7 four bank interleaving with Burst Length = 4; see component data sheet. Data Sheet HYS64D[32020/16000][H/G]DL–[5/6]–C Small Outline DDR SDRAM Modules V IL,MAX V ; IH,MIN for DQ, DQS and DM ...
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... DD3N modules currents are not included in the calculations (see note 1) DDQ 5) The module I values are calculated from the corrponent DDx Data Sheet HYS64D[32020/16000][H/G]DL–[5/6]–C Small Outline DDR SDRAM Modules 128MB 256MB 64 64 1 Ranks 2 Ranks –6 –6 Max. Typ. Max. ...
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... Mode register set command t cycle time Write preamble setup time t t Write postamble Write preamble t Address and control input setup t time Data Sheet HYS64D[32020/16000][H/G]DL–[5/6]–C Small Outline DDR SDRAM Modules –5 DDR400B DDR333 Min. Max. Min. –0.5 +0.5 –0.7 AC –0.6 +0.6 –0.6 DQSCK 0 ...
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... DQS could be HIGH, LOW, or transitioning from HIGH to LOW at this time, depending on 9) The maximum limit for this parameter is not a device limit. The device operates with a greater value for this parameter, but system performance (bus turnaround) degrades accordingly. Data Sheet HYS64D[32020/16000][H/G]DL–[5/6]–C Small Outline DDR SDRAM Modules –5 DDR400B DDR333 Min. ...
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... OH(ac) 11) For each of the terms, if not already an integer, round to the next highest integer. cycle time. 12) A maximum of eight Autorefresh commands can be posted to any given DDR SDRAM device. Data Sheet HYS64D[32020/16000][H/G]DL–[5/6]–C Small Outline DDR SDRAM Modules V . OL(ac) 21 Electrical Characteristics t is equal to the actual system clock CK Rev ...
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... Module Density per Rank 32 tAS, tCS [ns] Data Sheet HYS64D[32020/16000][H/G]DL–[5/6]–C Small Outline DDR SDRAM Modules HYS64D32020GDL–5–C HYS64D32020HDL–5–C 256 MB 256 MB 64 64 2 Ranks 2 Ranks PC3200S–3033–1 PC3200S–3033–1 Rev 1.0 Rev 1.0 HEX ...
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... Part Number, Char 16 89 Part Number, Char 17 90 Part Number, Char 18 Data Sheet HYS64D[32020/16000][H/G]DL–[5/6]–C Small Outline DDR SDRAM Modules HYS64D32020GDL–5–C HYS64D32020HDL–5–C 256 MB 256 MB 64 64 2 Ranks 2 Ranks PC3200S–3033–1 PC3200S–3033–1 Rev 1.0 Rev 1.0 ...
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... Interface Voltage Levels 9 tCK @ CLmax (Byte 18) [ns] 10 tAC SDRAM @ CLmax (Byte 18) [ns] Data Sheet HYS64D[32020/16000][H/G]DL–[5/6]–C Small Outline DDR SDRAM Modules HYS64D32020GDL–5–C HYS64D32020HDL–5–C 256 MB 256 MB 64 64 2 Ranks 2 Ranks PC3200S–3033–1 PC3200S–3033–1 Rev 1.0 Rev 1 ...
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... Module Density per Rank 32 tAS, tCS [ns] 33 tAH, TCH [ns] 34 tDS [ns] 35 tDH [ns not used Data Sheet HYS64D[32020/16000][H/G]DL–[5/6]–C Small Outline DDR SDRAM Modules 128MB 128MB 256MB 64 64 64 1 Rank 1 Rank 2 Ranks –6 –6 –6 PC2700S– PC2700S– ...
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... Part Number, Char 10 83 Part Number, Char 11 84 Part Number, Char 12 85 Part Number, Char 13 86 Part Number, Char 14 87 Part Number, Char 15 Data Sheet HYS64D[32020/16000][H/G]DL–[5/6]–C Small Outline DDR SDRAM Modules 128MB 128MB 256MB 64 64 64 1 Rank 1 Rank 2 Ranks –6 –6 –6 PC2700S– ...
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... Part Number, Char 18 91 Module Revision Code 92 Test Program Revision Code 93 Module Manufacturing Date Year 94 Module Manufacturing Date Week Module Serial Number ( -127 not used Data Sheet HYS64D[32020/16000][H/G]DL–[5/6]–C Small Outline DDR SDRAM Modules 128MB 128MB 256MB 64 64 ...
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... MIN. Detail of contacts 0.6 ±0.1 Burnished, no burr allowed Figure 4 Package Outlines – Raw Card C DDR-SDRAM SO-DIMM HYS64D16000[G/H]DL–6–C Data Sheet HYS64D[32020/16000][H/G]DL–[5/6]–C Small Outline DDR SDRAM Modules 67.6 63.6 (2.45) 100 ±0.1 47.4 ±0.1 (2.15) 200 0.45 ±0.03 28 Package Outlines 2.4 MAX. 1 ± ...
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... MIN. Detail of contacts 0.6 ±0.1 Burnished, no burr allowed Figure 5 Package Outlines – Raw Card A DDR SDRAM SO-DIMM HYS64D32020[G/H]DL–5/6]–C Data Sheet HYS64D[32020/16000][H/G]DL–[5/6]–C Small Outline DDR SDRAM Modules 67.6 63.6 ±0.1 (2.45) 100 ±0.1 47.4 ±0.1 (2.15) 200 0.45 ±0.03 29 Package Outlines 3 ...
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Published by Infineon Technologies AG ...