hys64d32020hdl-5-c Infineon Technologies Corporation, hys64d32020hdl-5-c Datasheet - Page 6

• Manufacturer Part Number: hys64d32020hdl-5-c
• Description: 200-pin Small Outline Dual-in-line Memory Modules
• Manufacturer: Infineon Technologies Corporation

200-Pin Small Outline Dual-In-Line Memory Modules
SO-DIMM
1
1.1
•
•
•
•
•
•
•
•
•
•
•
•
Table 1
Part Number Speed Code
Speed Grade
max. Clock Frequency
2
The HYS64D32020[H/G]DL–5–C and HYS64D[32020/16000][H/G]DL–6–C are industry standard 200-Pin Small
Outline Dual-In-Line Memory Modules (SO-DIMMs) organized as 32M  64 and 16M  64. The memory array is
designed with Double Data Rate Synchronous DRAMs (DDR SDRAM). A variety of decoupling capacitors are
mounted on the PC board. The DIMMs feature serial presence detect based on a serial E
2-pin I
available to the customer.
Data Sheet
Non-parity 200-Pin Small Outline Dual-In-Line Memory Modules
One rank 16M 64 and two ranks 32M 64 organization
JEDEC standard Double Data Rate Synchronous DRAMs (DDR SDRAM)
Single +2.5 V ( 0.2 V) power supply
Built with 256 Mbit DDR SDRAMs organised as 16 in P–TSOPII–66–1 packages
Programmable CAS Latency, Burst Length, and Wrap Sequence (Sequential & Interleave)
Auto Refresh (CBR) and Self Refresh
All inputs and outputs SSTL_2 compatible
Serial Presence Detect with E
Jedec standard form factor: 67.60 mm  31.75 mm  2.4 / 3.80 mm
Jedec standard reference layout Raw Cards A and C
Gold plated contacts
2
C protocol. The first 128 bytes are programmed with configuration data and the second 128 bytes are
Overview
Features
Performance
Description
2
PROM
Component
Module
@CL3
@CL2.5
@CL2
f
f
f
CK3
CK2.5
CK2
6
–5
DDR400B
PC3200–3033
200
166
133
HYS64D[32020/16000][H/G]DL–6–C
HYS64D32020[H/G]DL–5–C
–6
DDR333B
PC2700–2533
166
166
133
2
PROM device using the
Rev. 1.0, 2004-03
Unit
—
—
MHz
MHz
MHz