m378t2953ez3-ce600 Samsung Semiconductor, Inc., m378t2953ez3-ce600 Datasheet - Page 2

• Manufacturer Part Number: m378t2953ez3-ce600
• Description: 240pin Unbuffered Module Based On 512mb E-die 64/72-bit Non-ecc/ecc
• Manufacturer: Samsung Semiconductor, Inc.

Table of Contents
1.0 DDR2 Unbuffered DIMM Ordering Information ..........................................................................4
2.0 Features .........................................................................................................................................4
3.0 Address Configuration .................................................................................................................4
4.0 x64 DIMM Pin Configurations (Front side/Back side) ................................................................5
5.0 x72 DIMM Pin Configurations (Front side/Back side) ................................................................6
6.0 Pin Description ..............................................................................................................................6
7.0 Input/Output Functional Description ..........................................................................................7
8.0 Functional Block Diagram : .........................................................................................................8
9.0 Absolute Maximum DC Ratings .................................................................................................13
10.0 AC & DC Operating Conditions ...............................................................................................13
11.0 IDD Specification Parameters Definition ................................................................................15
12.0 Operating Current Table ...........................................................................................................16
13.0 Input/Output Capacitance ........................................................................................................19
14.0 Electrical Characteristics & AC Timing for DDR2-800/667/533/400 ......................................19
15.0 Physical Dimensions : ..............................................................................................................24
UDIMM
8.1 512MB, 64Mx64 Module - M378T6553EZS
8.2 512MB, 64Mx72 ECC Module - M391T6553EZ3
8.3 1GB, 128Mx64 Module - M378T2953EZ3
8.4 1GB, 128Mx72 ECC Module - M391T2953EZ3
8.5 256MB, 32Mx64 Module - M378T3354EZ3
10.1 Recommended DC Operating Conditions (SSTL - 1.8)
10.2 Operating Temperature Condition
10.3 Input DC Logic Level
10.4 Input AC Logic Level
10.5 AC Input Test Conditions
14.1 Refresh Parameters by Device Density
14.2 Speed Bins and CL, tRCD, tRP, tRC and tRAS for Corresponding Bin
14.3 Timing parameters by speed grade (DDR2-800 and DDR2-667)
14.4 Timing parameters by speed grade (DDR2-533 and DDR2-400)
15.1 64Mbx8 based 64Mx64 Module (1 Rank) - M378T6553EZS
15.2 64Mbx8 based 64Mx72 Module (1 Rank) - M391T6553EZ3
15.3 64Mbx8 based 128Mx64/x72 Module (2 Ranks) - M378T2953EZ3, M391T2953EZ3
15.4 32Mbx16 based 32Mx64 Module (1 Rank) - M378T3354EZ3
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Rev. 1.3 July 2008
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DDR2 SDRAM