htsich56 NXP Semiconductors, htsich56 Datasheet - Page 3

• Manufacturer Part Number: htsich56
• Description: Hitag S Transponder Ic
• Manufacturer: NXP Semiconductors

NXP Semiconductors
4. Quick reference data
5. Ordering information
Table 2.
[1]
HTSICH56_48_SDS
Product short data sheet
COMPANY PUBLIC
Type number
HTSICH5601EW/V7
HTSICH4801EW/V7
HTSICC5601EW/C7
HTSICC4801EW/C7
HTSMOH5601EV
HTSMOH4801EV
HTSFCH5601EV/DH
HTSFCH4801EV/DH
HTSH5601ETK
HTSH4801ETK
This package is also known as MOA2
Ordering information
Table 1.
[1]
[2]
Symbol
Wafer EEPROM characteristics
t
N
Interface characteristics
C
ret
endu(W)
i
Typical ratings are not guaranteed. Values are at 25 C
Measured with Q
Package
Name
Wafer
Wafer
Wafer
Wafer
PLLMC
PLLMC
FCP2
FCP2
HVSON2
HVSON2
Quick reference data
Parameter
retention time
write endurance
input capacitance
[1]
[1]
All information provided in this document is subject to legal disclaimers.
coil
= 20, L
Memory size
256 bit
2048 bit
256 bit
2048 bit
256 bit
2048 bit
256 bit
2048 bit
256 bit
2048 bit
Rev. 3.0 — 12 October 2011
coil
= 7.5 mH, optimal tuned to resonance circuit;
210330
Conditions
T
between IN1 and IN2
HTSICxxxxxEW/x7
amb
 55 C
Au-bumped die on sawn wafer, inkless
Au-bumped die on sawn wafer, inkless
Au-megabumped die on sawn wafer,
Au-megabumped die on sawn wafer,
plastic thermal enhanced very thin
plastic thermal enhanced very thin
Description
inkless
inkless
plastic leadless module carrier
package; 35 mm wide tape
plastic leadless module carrier
package; 35 mm wide tape
metal flip chip package; 2 leads;
35 mm wide tape
metal flip chip package; 2 leads;
35 mm wide tape
small outline package; no leads;
2 terminals; body 3  2  0.85 mm
small outline package; no leads;
2 terminals; body 3  2  0.85 mm
HTSICH56; HTSICH48
.
[2]
Min
10
100000
199
HITAG S transponder IC
V
IN1-IN2
Typ
-
210
© NXP B.V. 2011. All rights reserved.
= 2 V (RMS)
[1]
Max
-
221
Version
-
-
-
-
SOT500-3
SOT500-3
SOT732-1
SOT732-1
SOT899-1
SOT899-1
Unit
year
cycle
pF
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