mpxhz6130a Freescale Semiconductor, Inc, mpxhz6130a Datasheet - Page 6

• Manufacturer Part Number: mpxhz6130a
• Description: Media Resistant And High Temperature Accuracy Integrated Silicon Pressure Sensor For Measuring Absolute Pressure, On-chip Signal Conditioned, Temperature Compensated And Calibrated
• Manufacturer: Freescale Semiconductor, Inc

MPXHZ6130A
6
design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to a
Surface mount board layout is a critical portion of the total
MINIMUM RECOMMENDED FOOTPRINT FOR SUPER SMALL PACKAGES
Figure 5. SSOP Footprint (Case 1317 and 1317A)
0.150
3.81
SUPER SMALL OUTLINE PACKAGE
PACKAGE DIMENSIONS
0.050
CASE 1317-04
1.27
TYP
ISSUE F
0.053 TYP 8X
solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
1.35
0.027 TYP 8X
0.69
0.387
9.83
inch
mm
Freescale Semiconductor
Sensors