mpxh6300a Freescale Semiconductor, Inc, mpxh6300a Datasheet - Page 5

• Manufacturer Part Number: mpxh6300a
• Description: High Temperature Accuracy Integrated Silicon Pressure Sensor For Measuring Absolute Pressure, On-chip Signal Conditioned, Temperature Compensated And Calibrated
• Manufacturer: Freescale Semiconductor, Inc

Sensors
Freescale Semiconductor
design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to a
solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
Surface mount board layout is a critical portion of the total
Nominal Transfer Value:
Temperature Error Band
Pressure Error Band
Transfer Function (MPXH6300A)
Temperature
Factor
Error
-1.0
-2.0
-3.0
-4.0
4.0
3.0
2.0
1.0
0.0
4.0
3.0
2.0
1.0
0.0
Minimum Recommended Footprint for Super Small Outline Packages
V
± (Pressure Error x Temp Factor x 0.00318 x V
V
out
S
NOTE: The Temperature Multiplier is a linear response from 0°C to -40°C and from 85°C to 125°C.
= 5.1 ± 0.36 Vdc
= V
20
S
-40
x (0.00318 x P - 0.00353)
SURFACE MOUNTING INFORMATION
60
-20
100
0
140
0 to 85
Temp
MPXH6300A Series
125
-40
20
Temperature in °C
Break Points
180
40
Multiplier
Figure 5. SSOP Footprint (Case 1317 and 1317A)
220
3
1
3
S
60
0.150
3.81
)
260
80
300
100
0.050
1.27
TYP
120
20 to 304 (kPa)
Pressure
Error Limits for Pressure
140
0.053 TYP 8X
1.35
Pressure (in kPa)
0.387
0.027 TYP 8X
9.83
0.69
Error (Max)
±4.0 (kPa)
MPXH6300A
inch
mm
5