pah350s48 TDK Corp., pah350s48 Datasheet - Page 14

• Manufacturer Part Number: pah350s48
• Description: Compact And High-power Dc/dc Power-module
• Manufacturer: TDK Corp.

1
（1）Method to Fix
1 Mounting Method
mount power module onto printed circuit board.
By the following instruction shown in Fig.1-1 and Fig.1-2,
(1-1) Standard model
(1-2) /T option model
Fig.1-2 Mounting method for /T option model
Fig.1-1 Mounting method for standard model
To fix a power module onto printed circuit board, use
M3 screws and mount it to the M3 threaded holes (
places) of the power module. Recommended torque
is 0.N・m.
To fix a power module onto printed circuit board,
use M3 screws and mount it to the M3 threaded
holes of the heatsink ( places) through the φ3.
non-threaded holes ( places) of the power module.
Recommended torque is 0.N・m.
M3 Screw
Spring Washer
M3 Screw
Plain Washer
Spring Washer
Plain Washer
Heatsink
Heatsink
Silicone grease
M3 Threaded
Silicone grease
M3 Threaded
Power Module
Power Module
Printed Circuit Board
Printed Circuit Board
Plain Washer
Spring Washer
Plain Washer
M3 Screw
Spring Washer
M3 Screw
Plain Washer
Spring Washer
Plain Washer
M3 Screw
Spring Washer
M3 Screw
M3 Threaded
M3 Threaded
Heatsink
Heatsink
Silicone grease
φ3.4 Non-threaded
Silicone grease
φ3.4 Non-threaded
Power Module
Power Module
Printed Circuit Board
Printed Circuit Board
Mounting Hole
Mounting Hole
Mounting Hole
Mounting Hole
Mounting Hole
Mounting Hole
3. Installation
（2） Mounting Holes
（3） Mounting Holes on Printed Circuit Board
（）Recommended Material of PCB
（） Input / Output terminal pin
（）Input / Output Pattern Width
（1） Method to Fix
2 Heatsink Installation Method
(1-1) Standard model
(1-2) /T option model
baseplate. Connect baseplate to FG (Frame Ground) by
using this mounting holes
of hole and land diameter of printed circuit board.
Input / Signal terminals (φ1.0 mm )
Output terminals (φ2.0 mm )
Mounting Holes (FG)
power module.
double sided glass epoxy with through holes.
(thickness t: 1.mm , copper 3μm).
resistance is minimal. Note that if contact resistance is
high, efficiency will drop and power module will be dam-
aged by abnormal heat.
pattern width is too narrow, heat on pattern will increase
because of voltage drop of pattern. Relationship between
allowable current and pattern width varies depending on
materials of printed circuit board, thickness of conductor.
It is definitely necessary to confirm on manufacturers of
printed circuit board for designing pattern.
between heatsink and baseplate to minimize the contact
Mounting holes of the power module are connected to
Refer to the following sizes when determining diameter
For position of the holes, see outline drawing of the
Recommended materials of the printed circuit board is
Connect +Vin, -Vin,
Large current flows through input and output pattern. If
Use silicone grease or thermal conductive sheet in
To fix the heatsink onto power module, use M3 screws
and mount it to the M3 threaded holes ( places) at
the baseplate side. Recommended torque is 0. N ・ m.
To fix the heatsink onto power module, use M3
screws those are the same screws for mounting
power module onto printed circuit board.
Hole diameter : φ1. mm
Land diameter : φ3.0 mm
Hole diameter : φ2. mm
Land diameter : φ. mm
Hole diameter : φ3. mm
Land diameter : φ. mm
+
V,
-
V terminals such that contact