pah350s48 TDK Corp., pah350s48 Datasheet - Page 15

• Manufacturer Part Number: pah350s48
• Description: Compact And High-power Dc/dc Power-module
• Manufacturer: TDK Corp.

（2） Mounting Hole of Heatsink
3 Regarding Vibration
suming that only the power module is mounted on printed cir-
cuit board. To prevent excessive force to the module and the
printed circuit board, fix the heatsink to the chassis as well as
to the module when a large size of heastsink is used.
4 Recommended Soldering Method
Recommended soldering conditions are as follows.
age.
1）No output voltage
2）Output voltage is high
Verify following items before concluding power module dam-
The vibration specification of the module is determined as-
● Is specified input voltage applied?
● Are the ON/OFF control terminal (CNT), remote sens-
● For cases where output voltage adjustment is used, is
● Are there no abnormalities in the output load used?
● Is the baseplate temperature within the specified tem-
● Are the remote sensing terminals (
● Is the measurement done at the sensing points?
● For cases where output voltage adjustment is used, is
(2-1) Standard model
(2-2) /T option model
thermal resistance and to enhance the heat conductivity.
Also use the no-warped heatsink and make sure good
contact between baseplate and heatsink.
Recommended mounting hole is as follows.
ing terminal (+S,
(TRM) correctly connected?
the resistor or variable resistor setting, connections cor-
rectly done?
perature range?
connected?
the resistor or volume setting, connections correctly
done?
φ3. Non-threaded hole
M3 Threaded hole
4. Before concluding power module damage
-
S), output voltage trimming terminal
+
S, -S) correctly
（1）Soldering dip
（2）Soldering iron
（1）Cleaning solvent
（2）Cleaning Procedure
Dip condition : 20ºC within 10 seconds
Pre-heat condition : 100 to 130ºC for 30 to 0 seconds
※Soldering time changes according to heat capacity of soldering
5 Recommended Cleaning Condition
lows.
3）Output voltage is low
）Load regulation and line regulation is large
）Output ripple voltage is large
Recommended cleaning condition after soldering is as fol-
iron, pattern on printed circuit board, etc. Please confirm actual
performance.
● Is specified input voltage applied?
● Are the remote sensing terminals (+S, -S) correctly con-
● Is the measurement done at the sensing points?
● For cases where output voltage adjustment is used, is
● Are there no abnormalities in the output load used?
● Is specified input voltage applied?
● Are the input terminals and the output terminals firmly
● Is the measurement done at the sensing points?
● Is the input or output wire too thin?
● Is the measuring method used the same or equivalent
● Is the input ripple voltage value within the specified
φ1.0 mm : 30ºC (0W) within 3 seconds
φ2.0 mm : 30ºC (10W) within 20 seconds
IPA (isopropyl alcohol)
Use brush and dry the solvent completely.
nected?
the resistor or variable resistor setting, connections cor-
rectly done?
connected?
with the specified method in the Application Notes?
value?
1